Tacky Flux 6592

Tacky Flux 6592

Kester TSF-6592LV is a No Clean Paste Flux designed as a Lead Free Solution for an array of Lead Free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any Lead Free soldering application that requires a very tacky flux. It has been optimized...
  • Overview
      Tacky Flux 6592
       Kester TSF-6592LV is a No Clean Paste Flux designed as a Lead Free Solution for an array of Lead Free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any Lead Free soldering application that requires a very tacky flux. It has been optimized for consistent high speed printing applications.

      Performance Characteristics:
      • Compatible with Lead Free alloys such as SnAg, SnCu, SnAgCu, SnAgBi
      • Reflow-able with peak temperatures up to 270 °C
      • Reflow-able in air and nitrogen
      • Bright shiny soldered joints with clear residues
      • Aggressive flux on various substrates such as OSP-Cu, Immersion finishes and ENIG
      • Clear non-tacky residues
      • High tack to minimize skewing of components
      • Low voiding
      • Stencil Life of 8+ hours (process dependent)
      • Classified as ROL0 per J-STD-004
      • Compliant to Bellcore GR-78


      RoHS Compliance
      This product meets the requirements of the RoHS (Restriction of Hazardous Substances) Directive, 2002/95/EC Article 4 for the stated banned substances.

      Viscosity (typical): 235 poise
      Malcom Viscometer @ 10rpm and 25°C
      Initial Tackiness (typical): 100 grams
      Tested to J-STD-005, IPC-TM-650, Method 2.4.44
      Acid Number: 85 mg KOH/g of flux
      Tested to J-STD-004, IPC-TM-650, Method 2.3.13
      Copper Mirror Corrosion: 
      Low
      Tested to J-STD-004, IPC-TM-650, Method 2.3.32
      Corrosion Test: 
      Low
      Tested to J-STD-004, IPC-TM-650, Method 2.6.15
      Silver Chromate: 
      Pass
      Tested to J-STD-004, IPC-TM-650, Method 2.3.33
      Chloride and Bromides: 
      None Detected
      Tested to J-STD-004, IPC-TM-650, Method 2.3.35
      Fluorides by Spot Test: 
      Pass
      Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1
      SIR, IPC (typical): 
      Pass
      Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3

      Standard Applications:
      TSF-6592LV is designed for stencil/screen printing, rotating drum, slide fluxers and/or syringe applications. Great for rework applications on all PCB packages of various electronic devices. TSF-6592LV is great for rework applications on all PCB packages. TSF-6592LV can be used in BGA/PGA sphere/pin attachment vehicle or for repair and reballing/repinning. This flux works on flip chip, chip scale package and flip chip bumping sites assemblies as a soldering paste flux.

      Printing Parameters:
      Temperature/Humidity Optimal ranges are 21-25°C (70-77°F) and 35-65% RH

      Recommended Reflow Profiles:
      The recommended convection reflow profile for TSF-6592LV for Sn96.5Ag3.5, Sn99.3Cu0.7, or the various SnAgCu alloys is shown here. This profile is simply a guideline. As TSF-6592LV was engineered to be a versatile, robust interconnect material other reflow profiles would be effective.
      Your optimal profile may be different from the one shown based on your oven, component design,
      fixturing and mix of defects. Please contact Kester if you need additional profiling advice.



      Cleaning:
      TSF-6592LV is a no-clean chemistry. The residues do not need to be removed for typical applications.

      Storage, Handling, and Shelf Life: 
      Refrigeration is the recommended optimum storage condition for TSF-6592LV to maintain consistent viscosity, reflow characteristics and overall performance. TSF-6592LV should be stabilized at room temperature prior to printing. TSF-6592LV should be kept at standard refrigeration conditions, 0-10°C (32-50°F). Please contact Kester if you require additional advice with regard storage and handling of this material. Shelf life is 4 months from date of manufacture when handled properly and held at 0-10°C (32-50°F).
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