LORIOT INDUSTRIAL CO.,LTD

LORIOT INDUSTRIAL CO.,LTD

Loriot đồng hành cùng các nhà công nghiệp điện tử Việt Nam
Loriot đồng hành cùng các nhà công nghiệp điện tử Việt Nam

Hơn 13 năm hoạt động tại thị trường Việt Nam, Công ty TNHH Loriot Việt Nam (Loriot Việt Nam) đã trở thành doanh nghiệp hàng đầu trong lĩnh vực cung cấp sản phẩm,...

Defect due to Reflow
Defect due to Reflow

1. Ramp @ 60-150oC for 40-80sec at Ramp rate <2.5oC/sec 2. Soak @ 150-2170oC for 60-120 sec. 3. Reflow @ > 220oC for 45-90 sec. 4. Peak temp 235 - 250oC.

Defect due to Pick & Place machines
Defect due to Pick & Place machines

Component Placements Types of part placements issues XY or rotational placement error Incorrect placement pressure or ‘Z’ height Parts shifting during board handling Tomb-stoning...

Defect due to Printing
Defect due to Printing

Solder Paste Printing Objectives Avoid bridges. Deposit appropriate amount of solder paste consistently in the proper location .Printing Defects 60-70% Of SMT defects are caused by the...

What is Solder paste
What is Solder paste

Solder Paste is a consistent homogeneous mixture of solder powder (metal) in a stable viscous flux vehicle which is used to join two metal surfaces upon heating. 90% Metal by weight for printing appl...

Printing Process
Printing Process

What is Printing? Printing is the deposition of a known amount of solder paste on a component pad.

Reflow Soldering
Reflow Soldering

COOLING Solidification of the solder joint and cooling of the laminate Faster cooling results in finer grain size with higher fatigue resistance Do not exceed cooling rate of -4oC/s to avoid thermal...

Method of trouble shooting
Method of trouble shooting

The objective of this presentation is to gain an understanding of the process defects that can occur with solder paste on an SMT production line Stencil Printing Dispensing Placement ...