Denon BGA rework 500III & 500SIII

Denon BGA rework 500III & 500SIII

Trouble Free Internal Flash Memory Hard Drive ■ 3 Separate Heaters for Lead Free Solder ■ Long Wave IR Area Heater to Prevent PCB Warping ■ 2 Mode
  • Overview

      Denon BGA Rework 500III & 500SIII

       

      ​ Trouble Free Internal Flash Memory Hard Drive

      • 3 Separate Heaters for Lead Free Solder

      ​ Long Wave IR Area Heater to Prevent PCB Warping

      ​ 2 Mode Cooling Functions

      ​ Security Lock-out Function

      ​ 2 Point Component Control Auto-profiling

      ​ Convenient Inspection Function

      ​ 5 Thermocouple Inputs

      ​ Fully Integrated from Solder Cream Application to Component Placement

      ​ Semi-automatic System

      ​ Useful for a Wide Variety of Rework                          
       

      3 Separate Heaters for Lead Free Rework

      Because the top and bottom heaters are high power hot air, the machine is able to create and maintain an efficient reflow profile which is safe and stable. In addition, the system includes strong IR underside area heaters which prevent the PCB from warping.

      3 Point Cooling System

      Once the reflow profile is complete, cool air is provide both through the nozzle and from a cooling fan which can be selected separately. The addition of cool air after the reflow cycle has been shown to improve lead free solder connections.

      2 Point Component Control Auto-profiling

      The 2 Point Auto-Profile function allows the user to create an optimum profile automatically by monitoring the solder ball temperature for the solder reflow conditions and by monitoring the top of the component to ensure the component does not overheat during the profile.

      Take the thermocouples which have been attached to the top of the component and the solder ball and plug them into the Sensor Ports.

      In the Auto-Profile Tab, set the desired profile on the graph. During the test run, the Auto- Profile automatically measures and stores the data necessary for rework profile.

      Pull up the saved data in the Development Tab and run it again to confirm the profile. 

      Integrated Component Preparation, Alignment and Placement

      The BP500 Solder Paste Preparation Kit is included as a standard accessory (stencils are optional). It allows the user to apply solder paste directly to the balls of the component. This is then placed in the Optic Arm and is ready for alignment to the PCB. The Alignment software then allows the user to zoom, focus, and split screen for maximum easy in alignment and placement. Here are the basic steps.

      Take the thermocouples which have been attached to the top of the component and the solder ball and plug them into the Sensor Ports. 

      Apply solder or flux paste to the component.

      Deploy the Optics Arm and place the BP500 with the component to be picked.

      Using the table movement knobs, align the PCB to the component as necessary. If theta adjustment is required, it can be done via the Theta Adjustment Knob on the front of the heater head.

      Screen Split The screen split function will enlarge and split the view so it is easier to view and align the component to the board.

       

       

       

       

       

  • Benefits and Features
  • Enhanced Technology