Value Leader in Wave Soldering
As the complexity of board assemblies continues to increase, board manufactures are looking for the best solution in a wave soldering system. The solution must meet their soldering expectations for today and far into the future.
The VectraES with it’s extensive list of features utilize technologies that provide complete process flexibility and process control.
Proven Performance, World Class Results
Achieving the best solder joint quality, maximum topside hole fill, and zero defect soldering are requirements in all industries. The VectraES features such as ServoJet™ fluxing, forced convection preheat, and UltraFill™ solder nozzles provide board assemblers the capability to process the most difficult soldering applications in the most demanding environments.
Lead-Free Process Capability
The VectraES is designed to handle lead free applications for many years. The cast iron solder pot and its components are resistant to the corrosive nature of lead-free solders and are capable of withstanding temperatures of 302° C (576° F). All stainless steel components that come into contact with the solder are composed of a special corrosion resistive surface conversion as standard or titanium as an option. Features such as our Quick Change Solder Pot provide the flexibility to easily change alloys in a safe and timely manner.
Proven performance and reliability are key. Electrovert holds the industry reputation as having the most reliable wave soldering that lasts the longest when compared to other brands. Board assemblers know the value in owning an Electrovert wave soldering system. The VectraES carries a lifetime warranty on the solder pot casting to the original owner (see the full explanation in terms and conditions).
Conveyor: Process Width Capability
The robust conveyor is designed to handle demanding production environments yet is easy to maintain. Standard features such as automatic lead clearance adjustment allow complete process control. A soldering process width of 457 mm (18 inches) is standard.
Solder Nozzle Technologies
Electrovert’s UltraFill™, DwellMax™ Plus and DwellMax Ultra solder nozzles are designed to provide maximum top-side hole fill, provide the best hole fill quality, improve first pass yields, reduce dross , and promote easy maintenance. DwellMax Plus’ extra-wide chip nozzle and modified UltraFill nozzle are ideal for soldering thick, high thermal mass circuit boards.
The VectraES is capable of up to 1.8 meters (6 feet) of bottom side preheat and up to 1.2 meters (4 feet) of topside preheat. Multiple types of preheat are offered for complete process flexibility (High velocity forced convection and calrod IR type). The optional quick plug feature allows plug and play preheat configurations that are easy to change.
As the complexity of board assemblies continues to increase, fluxing quality has become more of a focus to ensure soldering quality is achieved. Electrovert is ahead of competitors and offer the best fluxing technologies available in the marketplace. The ServoJet™ fluxing system provides the ultimate in precision deposition and hole penetration (OA version available for aggressive flux applications) while ServoSonic™ and ServoSpray™ fluxing systems are available for ultrasonic and value based solutions. The VectraES is available with either foam or spray type fluxers.
Operations and Software
Electrovert’s software and operation controls were designed with user interface in mind. The Windows® operating system is multi-functional and easy to use. The 3D GUI provides the user a real-time view of the complete machine modules, operation, and product being soldered. All Electrovert systems have a customizable quick view screen that allows engineers and operators to view critical machine parameters that are important to the process or application.