Kester TSF-8808 Tacky Flux

Kester TSF-8808 is a synthetic water-soluble tacky soldering flux formula engineered for ultra-fine pitch semiconductor packaging and high-precision electronic assembly. Manufactured by Kester, this advanced flux formulation contains no intentionally added halogens, making it fully compliant with international environmental and halide-free standards.

Key Features of Kester TSF-8808

Formulated to eliminate component movement and simplify post-reflow cleaning, this synthetic tacky flux offers major technical advantages:

• Halide-Free Compliance: Formulated to meet the IEC 61249-2-21 definition for halide-free electronic materials.
• Low Volatile Content: Engineered with low volatile compounds to significantly reduce outgassing and prevent component misalignment during reflow, particularly for ultra-thin flip chip dies.
• Versatile Metallurgy Compatibility: Acts as a direct drop-in replacement across low-melting-point alloys (SnBi), typical tin-lead eutectic, and high-melting-point lead-free alloys (SnAg, SnCu, SnAgCu).
• Cost-Effective DI Water Cleaning: Post-reflow residues are completely soluble in water, allowing clean-up using pure deionized (DI) water without expensive chemical additives.

Applications and Usage

This synthetic water-soluble flux is optimized for critical micro-electronic assembly where post-solder cleanliness and precision alignment are mandatory:

1. Ultra-thin flip chip die attach and precision component placement.
2. BGA, PGA, and CSP ball attach and rework applications.
3. Multi-alloy interconnect soldering requiring pure water-wash residue removal.

Technical Specifications

Conclusion

Utilizing Kester TSF-8808 in your micro-assembly lines minimizes component drift while significantly lowering cleaning costs with simple DI water washing. For technical datasheets, pricing, or product availability, please visit Contact – LORIOT INDUSTRIAL.