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979VT SOLDERING FLUX

The Best Wetting Properties Available in a VOC-Free Liquid Flux

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952-S SOLDERING FLUX

The No-Clean General Use Wave Solder Flux

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985M SOLDERING FLUX

The No-Clean General Use Wave Solder Flux

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268 FLUX-CORED WIRE

The Activated Rosin Flux Designed for Instant Wetting Action

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275 FLUX-CORED WIRE

The Activated Rosin Flux Designed for Instant Wetting Action

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TIN-LEAD (SNPB) BAR SOLDER

K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives.

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NP505-LT SOLDER PASTE

The Activated Rosin Flux Designed for Instant Wetting Action

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NP545 SOLDER PASTE

The Activated Rosin Flux Designed for Instant Wetting Action

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331 FLUX-CORED WIRE

The Activated Rosin Flux Designed for Instant Wetting Action

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44 FLUX-CORED WIRE

The Activated Rosin Flux Designed for Instant Wetting Action

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