September 8, 2026

WP616 Solder Paste is a zero-halogen, lead-free, water-soluble formula for nitrogen and air reflow applications.

September 8, 2026

R560 reduces BGA voiding to under 5%, offering water-soluble performance and high humidity slump resistance.

September 8, 2026

Kester R520A Solder Paste is a lead-free, water-soluble formula for SAC alloys offering anti-slump performance

September 7, 2026

Kester R500 Solder Paste is an aggressive, water-soluble dispensing paste with 8-hour tack life for automated systems.

September 7, 2026

Kester R276 Solder Paste is a no-clean dispensing paste available in Sn63Pb37 and SAC305 alloys for precise application.

September 7, 2026

Kester R231 Solder Paste is an RMA formula offering up to 8 hours of stencil print life and stable activity.

September 7, 2026

Kester NXG1 Solder Paste offers 8-month shelf life, 120-min downtime capability, and shiny lead-free joints.

September 7, 2026

NP575-KAP Solder Paste is a zero-halogen, no-clean material for high-reliability

September 7, 2026

Kester R562 Solder Paste offers extreme environmental resistance, high activity, and stable tack for reliable PCB assembly.

September 7, 2026

Kester NP560 Solder Paste offers lead-free, halogen-free assembly with ultra-low voiding and high-precision 01005 printing