icon-lich.svgSeptember 28, 2026

Kester TSF-ULR18

Kester TSF-ULR18 is an ultra low residue no-clean tacky flux with under 10% wt post-reflow residue, ideal for micro-ball.

icon-lich.svgSeptember 28, 2026

Kester TSF-8808

Synthetic water-soluble, compliant with IEC 61249-2-21, featuring low outgassing for thin flip chip die assembly.

icon-lich.svgSeptember 25, 2026

Kester TSF-6852

Room-temperature stable, synthetic water-soluble tacky flux classified ORH1 for lead-free, tin-lead, and low-temp alloys.

icon-lich.svgSeptember 25, 2026

Kester TSF-6592LV

Low-viscosity, lead-free no-clean paste flux optimized for high-speed printing, flip chip attach, and BGA rework.

icon-lich.svgSeptember 25, 2026

Kester TSF-6592HF

Halogen-free, lead-free no-clean paste flux optimized for high-speed printing, flip chip attach, and BGA rework.

icon-lich.svgSeptember 25, 2026

Kester TSF-6592

High-tack no-clean paste flux designed for lead-free interconnect applications including flip chip attach and BGA.

icon-lich.svgSeptember 25, 2026

Kester TSF-6522RH

Rosin-based, halide-free no-clean tacky soldering flux designed for BGA/PGA dispensing and SMT rework compliance.

icon-lich.svgSeptember 25, 2026

Kester TSF-6522

Kester TSF-6522 is a high-performance ROL0 no-clean tacky soldering flux designed for BGA rework, dot dispensing.

icon-lich.svgSeptember 24, 2026

Kester TSF-6502JCR Tacky Flux

Tacky Flux is a high-activity no-clean formula designed to solder nickel

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