product

Kester TSF-ULR18 is an ultra low residue no-clean tacky flux with under 10% wt post-reflow residue, ideal for micro-ball.

Synthetic water-soluble, compliant with IEC 61249-2-21, featuring low outgassing for thin flip chip die assembly.

Room-temperature stable, synthetic water-soluble tacky flux classified ORH1 for lead-free, tin-lead, and low-temp alloys.

Low-viscosity, lead-free no-clean paste flux optimized for high-speed printing, flip chip attach, and BGA rework.

Halogen-free, lead-free no-clean paste flux optimized for high-speed printing, flip chip attach, and BGA rework.

High-tack no-clean paste flux designed for lead-free interconnect applications including flip chip attach and BGA.

Rosin-based, halide-free no-clean tacky soldering flux designed for BGA/PGA dispensing and SMT rework compliance.

Kester TSF-6522 is a high-performance ROL0 no-clean tacky soldering flux designed for BGA rework, dot dispensing.

Tacky Flux is a high-activity no-clean formula designed to solder nickel

ALPHA SAC305 Lead-Free Alloy delivers exceptional thermal fatigue resistance