Kester 268 Cored Wire Overview
Kester 268 Cored Wire is a zero-halogen flux-cored wire optimized for high-precision robotic and manual soldering, manufactured by Kester. Formulated without halides or halogen additives, it delivers reliable joint formation and processing speeds comparable to traditional halide-based soldering systems.
Key Features of Kester 268 Cored Wire
Engineered to meet stringent environmental standards and precision automation needs, this wire offers key technical benefits:
- Zero-Halogen & Halide-Free Chemistry: Contains no intentional additions of bromine or chlorine, complying fully with IEC 61249-2-21, JPCA-ES-01, and IPC-410B.
- Robotic Soldering Optimization: Delivers smooth, clean release performance to prevent solder bridging and icicle formation in tight pitch drag soldering.
- ROL0 Flux Classification: Categorized as Type ROL0 under J-STD-004B specifications, ensuring long-term surface insulation reliability.
- Clear Post-Solder Residue: Leaves a clean, non-corrosive residue, eliminating the need for post-soldering wash steps.
- Equivalent Performance: Matches the speed, wetting capability, and spreading performance of traditional halide-activated flux systems.
Applications & Process Advantages
The specialized chemistry system of this cored solder wire prevents tip burn-up and minimizes spatter, making it suitable for continuous automated assembly lines as well as precision manual rework. Its resistance to bridging ensures high yield rates when soldering high-density electronic assemblies with narrow pin spacing.
Conclusion
In conclusion, Kester 268 Cored Wire provides consistent workability and halide-free reliability for automated assembly. For inquiries or orders, please reach out via Contact – LORIOT INDUSTRIAL.
Technical Specifications
| Property / Parameter | Specification Details |
|---|---|
| Product Type | Zero-Halogen Flux-Cored Solder Wire |
| J-STD-004B Classification | Type ROL0 |
| Halogen / Halide Content | Zero-Halogen & Halide-Free (No intentional Br/Cl addition) |
| Environmental Compliance | IEC 61249-2-21, JPCA-ES-01, IPC-410B |
| Primary Applications | Automated / Robotic Drag Soldering, Manual Soldering |
| Post-Solder Cleaning Requirement | No-Clean (Clear, non-corrosive residue) |
| Bridging Control | Clean tip release prevents bridges and protrusions |

