icon-lich.svgNovember 10, 2026

HT-1331S

High-viscosity surface mount adhesive designed for fast heat curing, wave soldering, and high-speed dispensing.

icon-lich.svgNovember 10, 2026

HT-130S

Fast heat-curable surface mount adhesive designed for high-speed dispensing and wave soldering applications.

icon-lich.svgNovember 9, 2026

HI-POXY 9100

9100 is a low-temperature heat-cure epoxy coating that reinforces solder joints and protects IC devices from drop damage.

icon-lich.svgNovember 9, 2026

ALPHA UNIQUE 3075YHF

3075YHF is a reworkable, halogen-free underfill epoxy designed to improve BGA attachment strength.

icon-lich.svgNovember 9, 2026

ALPHA HT-130DM

HT-130DM is a fast heat-curable surface mount adhesive designed for high-speed dispensing and wave soldering.

icon-lich.svgNovember 9, 2026

ALPHA HT-130DL

HT-130DL is a fast heat-curable surface mount adhesive for high-speed dispensing and screen printing in wave soldering.

icon-lich.svgNovember 9, 2026

ALPHA HiTech UP44-5566T

UP44-5566T is a fast-curing UV adhesive designed for coating and fixing electronic components securely.

icon-lich.svgNovember 9, 2026

ALPHA HiTech UP44-5311F

UP44-5311F is a fast UV-cure encapsulant designed to reinforce solder joints and prevent IC chip cracking.

icon-lich.svgNovember 9, 2026

ALPHA HiTech UNIQUE 3075BHF

Halogen-free underfill epoxy designed to improve BGA attachment strength.

icon-lich.svgNovember 9, 2026

ALPHA HiTech CU32-380

CU32-380 is a low-viscosity capillary underfill providing impact resistance and solder joint stress relief.

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