Kester Solid Wire

Kester Solid Wire

icon-lich.svg October 22, 2026

Kester Solid Wire High Purity Solder Overview

Kester Solid Wire is a high-purity leaded solder wire manufactured by Kester for high-reliability soldering applications. Engineered specifically for surface mounted components, through-hole assembly, and final connection processes, this wire uses only virgin metals of the highest purity grade to satisfy strict electronic manufacturing criteria.

Technical Features of Kester Solid Wire

Formulated for assembly lines where joint integrity and electrical reliability are paramount, this leaded solid wire offers high quality control standards:

  • Maximum Alloy Purity: Formulated using refined metals to ensure complete purity without unverified composition claims.
  • IPC Specification Compliance: Fully meets the requirements of ANSI/IPC J-STD-006C Amendment 1 for electronic grade solder alloys.
  • Strict Impurity Control: Exceeds industry standards by capping harmful trace elements such as Aluminum, Cadmium, and Zinc at extremely low thresholds.
  • High Reliability Performance: Ideal for critical surface mount device (SMD) and through-hole soldering where thermal and mechanical fatigue resistance is required.
  • Consistent Mass Tolerance: Controlled alloy constituent deviation ensures uniform melting behavior and predictable joint formation batch after batch.

Alloy Composition & Impurity Control Specifications

To preserve solder joint strength and avoid brittle intermetallic compound formation, impurity levels are held to rigid limits. Trace elements such as Cadmium (Cd ≤ 0.002%) and Zinc (Zn ≤ 0.003%) are strictly restricted to prevent drossing and poor wetting during assembly operations.

Conclusion

In conclusion, Kester Solid Wire provides strict impurity control and exceptional alloy purity for critical electronic assembly. For quotes and technical support, contact Contact – LORIOT INDUSTRIAL.

Technical Specifications

Element / Parameter Maximum Allowed Impurities (ANSI/IPC J-STD-006C Amendment 1)
Antimony (Sb) 0.200%
Copper (Cu) 0.080%
Gold (Au) 0.050%
Silver (Ag) / Bismuth (Bi) / Indium (In) 0.100% each
Arsenic (As) 0.030%
Iron (Fe) 0.020%
Nickel (Ni) 0.010%
Aluminum (Al) 0.005%
Zinc (Zn) 0.003%
Cadmium (Cd) 0.002%
Alloy Mass Percentage Deviation Tolerance Nominal < 0.10%: ≤ 0.020% of alloy mass
Nominal > 0.10% to < 1.0%: ≤ 0.10% of alloy mass
Nominal > 1.0% to < 5.0%: ≤ 0.20% of alloy mass
Nominal > 5.0%: ≤ 0.50% of alloy mass

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