ADVANTISV PLATFORM

August 3, 2021

ADVANTISV PLATFORM

 

AdvantisV platform leverages high-end base technologies and easily integrated premium options to deliver cost-effective, value-driven productivity in low-margin environments. This versatility, coupled with a robust architecture with minimal maintenance requirements, provides investment protection and a low cost of ownership. AdvantisV incorporates a highly accurate architecture and closed-loop controls for superior yields. It also generates exceptional and consistent output across a range of environments from NPI to volume production. AdvantisV has all the functionality to meet today’s challenges, with a growth path for tomorrow’s.

• 1 and 2-beam variants utilizing flagship Fuzion base architecture
• Throughput up to 66,500 cph per module
• Complementary high-speed and multifunction models
• Minimal entry price and initial investment
• Simplified base configurations, easily integrated options
• Premium options, including advanced NPI toolbox
• Broadest component range and board size capabilities
• Class-leading performance and technologies for long usable life
• Low cost of ownership with minimal maintenance requirements

ADVANTISV MODELS & SPECS

AdvantisV1-07 – A versatile IC placement platform, perfect for special processes such as pin-in-paste and OFA

AdvantisV1-30 – Superb for high-mix NPI environments and large board applications. Also a high-volume line booster solution.

AdvantisV2-60 – Flexible, high-speed productivity for medium-volume environments. Also a powerful line booster solution or high-performance small part placer.

	Max Throughput (cph)	Accuracy (µm) at greater than 1.00 Cpk	Max Board Size	Max Board Size	Max Board Size
AdvantisV1-07	16,500	±38 (Chips) / ±27 (ICs)	508 x 813mm	128 (1 ULC)	0201 – 150mm sq, 40mm tall
AdvantisV1-30	35,000	±38 (Chips) / ±27 (ICs)	508 x 1016mm	136	0201 – 150mm sq, 40mm tall
AdvantisV2-60	66,500	±34 (Chips) / ±34 (ICs)	508 x 1300mm	136	01005 – 30mm sq