VectraElite Wave Soldering Machine

VectraElite Wave Soldering Machine

icon-lich.svg August 3, 2021



The Electrovert® VectraElite™ wave soldering machine is ideal for medium-to-high mass board assemblies where fast changeover, process flexibility, and system reliability are required. The VectraElite combines innovative technology in an accessible, ergonomic platform with a zero-defect process at the lowest possible cost of ownership. Process width is 457mm (18 in) with optional 508mm (20 in ), short and full N2 tunnel features.

Electrovert’s new Flux Flow Monitor provide excellent means of verifying repeatability andlarm monitoring capability.  Electrovert’s flux flow monitor is intended for applications that flux flow verification is critical to the wave soldering process. The feature provides an accurate method of verifying repeatability of the flux flow rate and flux volume on a board-to-board basis.

Proven Performance, World Class Results

Achieving the best solder joint quality, maximum topside hole fill, and zero defects are challenges with high mass, difficult-to-solder PCBs.  The Vectraelite Wave Soldering Machine features, including ServoJet™ fluxing, forced convection preheat, and DwellMax Plus™ solder nozzles, provide board assemblers the capability to process the most difficult soldering applications in the most demanding environments.

Lead-Free Process Capability

The VectraElite has been soldering lead-free applications for many years.  The cast iron solder pot and its components are resistant to the corrosive nature of lead-free solders, and are capable of withstanding temperatures of 302° C (576° F).  All stainless steel components that come into contact with the solder are composed of a special corrosion-resistant surface conversion as standard, or titanium as an option.  Features such as our Quick Change solder pot provide the flexibility to easily change alloys in a safe and timely manner.


Electrovert holds the industry reputation for building the most reliable and longest-lasting wave soldering systems. The VectraElite carries a lifetime warranty on the solder pot casting to the original owner (see the full explanation in terms and conditions).

Conveyor: Process Width Capability:

The robust conveyor is designed to handle the weight of thick boards and pallets; and automatic lead clearance adjustment is standard.  A soldering process width of 457 mm (18 inches) is standard while a process width of 508 mm (20 inches) is optional.

Solder Nozzle Technologies

Electrovert’s UltraFill™, DwellMax™ Plus and DwellMax Ultra solder nozzles are designed to provide maximum top-side hole fill, provide the best hole fill quality, improve first pass yields, reduce dross , and promote easy maintenance. DwellMax Plus’ extra-wide chip nozzle and modified UltraFill nozzle are ideal for soldering thick, high thermal mass circuit boards.

Fluxing Technologies

As the complexity of board assemblies continues to increase, fluxing quality has become more of a focus to ensure soldering quality.  Electrovert offers the best fluxing technologies available.  The ServoJet fluxing system provides the ultimate in precision deposition and hole penetration (OA version available for aggressive flux applications) while ServoSonic™ and ServoSpray™ fluxing systems are available for ultrasonic and value-based solutions.

Operations and Software

Electrovert’s software and operation controls were designed with user interface in mind.  The Windows® operating system is multi-functional and easy to use.  The 3D GUI provides the user a real-time view of the complete machine modules, operation, and product being soldered.  All Electrovert systems have a customizable quick view screen that allows engineers and operators to view critical machine parameters that are important to the process or application.


Related products


The Centurion™ reflow soldering oven is a forced-convection SMT reflow system with tight, closed-loop process control, built for today’s high-throughput PCB assembly environments


Electrovert's new Flux Flow Monitor provides an accurate method of verifying repeatability of the flux flow rate and flux volume on a board-to-board basis.

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