November 9, 2026 ALPHA HiTech CU32-380 Low Viscosity Underfill
ALPHA HiTech CU32-380 is a one-component capillary underfill designed for the encapsulation and protection of assembled chip packages on printed circuit boards. Manufactured by MacDermid Alpha, this high-performance material effectively releases stress caused by CTE mismatch between electronic components and the PCB substrate. Electronics manufacturers choose ALPHA HiTech CU32-380 for high-density SMT assemblies requiring fast flow properties and exceptional impact resistance under harsh mechanical conditions.
Key Features and Benefits of ALPHA HiTech CU32-380
This advanced capillary underfill epoxy offers a balanced combination of mechanical protection, low moisture absorption, and processing efficiency:
- Low Viscosity Formulation: Enables rapid, efficient capillary flow underneath fine-pitch chip packages.
- Superior Impact Resistance: Protects solder joints from drop and shock damage, showing no impact bend failure on test boards after 10,000 cycles.
- CTE Mismatch Stress Relief: Distributes mechanical thermal stress over a wide area, protecting interconnects.
- Low Moisture Absorption: Ensures long-term electrical reliability in challenging operating environments.
- Eco-Friendly Compliance: Halogen-free formulation fully compliant with RoHS Directive 2011/65/EU.
Processing Guidelines and Curing Conditions
Dispensing ALPHA HiTech CU32-380 is performed efficiently under standard room temperature conditions. Syringes must be stored upright at < -20 °C with the tip facing downward to ensure material stability. Prior to application, remove the syringe from the freezer and allow it to thaw at room temperature for 2 hours without opening the cap. Once thawed, the material must not be refrozen or returned to its original container. Full mechanical properties are developed by curing in a convection oven at 130 °C for a minimum hold time of 8 minutes.
Technical Specifications
| Category / Parameter | Specification Details |
|---|---|
| Chemistry & Appearance | One-component Capillary Underfill (Black) |
| Viscosity @ 25 °C | 300 to 800 cP (RVDV-II Brookfield #4 @ 20 rpm) |
| Glass Transition Temperature (Tg) | 199 ± 20 °C (via TMA) |
| CTE (α1) | 80 to 90 ppm |
| Hardness / Storage Modulus | 80 to 90 (Shore D) / 1.27 GPa @ 25 °C (via DMA) |
| Pot Life / Shelf Life | 3 days @ 25 °C / 6 months @ < -20 °C |
| Curing Profile (Convection Oven) | 130 °C for minimum 8 minutes |
| Environmental Standards | Halogen-free, RoHS Directive 2011/65/EU compliant |
Conclusion
In summary, ALPHA HiTech CU32-380 represents a highly dependable underfilling solution that enhances component reliability and solder joint integrity under thermal and mechanical stress. For technical support, detailed datasheets, or commercial inquiries, please contact us via Contact – LORIOT INDUSTRIAL.
