November 9, 2026 ALPHA HT-130DM Surface Mount Adhesive
ALPHA HT-130DM is a one-component, intermediate-temperature, fast heat-curable surface mount adhesive engineered for high-speed dispensing and screen printing applications. Developed by MacDermid Alpha, this epoxy-based red paste provides excellent productivity during wave-soldering processes. Electronics manufacturers rely on ALPHA HT-130DM to hold surface-mount components firmly in position on printed circuit board (PCB) assemblies prior to wave soldering.
Key Features and Benefits of ALPHA HT-130DM
This high-performance surface mount adhesive delivers balanced mechanical and thermal properties tailored for SMT assembly lines:
- Fast Heat Curing: Rapidly cures at intermediate temperatures, such as 80 seconds at 150 °C in a convection oven.
- Excellent Thermal Resistance: Withstands elevated processing temperatures during wave soldering without degrading bond integrity.
- Non-Sagging Profile: Features a high thixotropic index (> 4.0) to maintain crisp dot height and prevent slumping.
- Excellent Workability: Formulated for consistent performance across high-speed automated dispensers and screen print setups.
- One-Component Convenience: Supplied ready-to-use in customized syringe options according to customer requirements.
Processing Guidelines and Curing Profiles
Applying ALPHA HT-130DM on assembly lines enables operators to achieve consistent dot geometry and high production speeds. Uncured, this red paste exhibits a controlled viscosity of 550 to 650 Poise (Malcom PC-10A, 30 rpm @ 25 °C), a pot life of 7 days at 25 °C, and a shelf life of 6 months when refrigerated between 1 and 10 °C. Optimum cure conditions in a convection oven are typically achieved at 150 °C with a minimum hold time of 80 seconds.
Technical Specifications
| Category / Parameter | Specification Details |
|---|---|
| Chemistry & Appearance | Epoxy (Red paste) |
| Application Methods | High-speed Dispenser & Screen Print |
| Viscosity @ 25 °C | 550 to 650 Poise (Malcom PC-10A, 30 rpm) |
| Thixotropic Index / Specific Gravity | > 4.0 / 1.0 to 1.4 |
| Pot Life / Shelf Life | 7 days @ 25 °C / 6 months @ 1 to 10 °C |
| Convection Oven Curing Profile | 80 seconds @ 150 °C |
Conclusion
In summary, ALPHA HT-130DM offers a fast-curing, reliable surface mount adhesive solution tailored for wave-soldering operations in high-density electronics manufacturing. For technical support, product datasheets, or commercial quotes, please reach out via Contact – LORIOT INDUSTRIAL.
