icon-lich.svgNovember 9, 2026

ALPHA HiTech CF41-20000S-B(L)

One-component edgebond epoxy cured during Pb-free reflow to protect solder...

icon-lich.svgNovember 9, 2026

ALPHA HiTech CF31-4026

CF31-4026 is a reworkable, halogen-free edgebond epoxy designed for high thermal cycling reliability in electronics.

icon-lich.svgNovember 9, 2026

ALPHA HITECH AD13-9100A

One component halogen-free low temperature adhesive designed for bonding various substrates.

icon-lich.svgNovember 9, 2026

ALPHA HI-FILL 3150

3150 is a one component halogen-free low viscosity epoxy adhesive designed for heat sensitive electronic devices.

icon-lich.svgNovember 4, 2026

ALPHA HI-POXY 9600W

HI-POXY 9600W is a one component halogen-free epoxy adhesive designed for bonding heat sensitive electronic devices.

icon-lich.svgNovember 4, 2026

ALPHA HI-POXY 9554W

HI-POXY 9554W is a one component halogen-free epoxy adhesive designed for bonding heat sensitive electronic devices.

icon-lich.svgNovember 4, 2026

ALPHA HI-POXY 9490TM

9490TM is a one component halogen-free epoxy adhesive designed for bonding heat sensitive devices.

icon-lich.svgNovember 4, 2026

ALPHA HI-POXY 9490BM

One component halogen-free epoxy adhesive designed for bonding heat sensitive electronic devices.

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ALPHA HI-POXY 4007B

HI-POXY 4007B is a one component halogen-free epoxy adhesive designed to improve mechanical attachment strength.

icon-lich.svgNovember 4, 2026

ALPHA HI-FILL 3100

Underfill epoxy features high Tg, low CTE, and fast flow-speed for BGA solder joint mechanical protection.

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