icon-lich.svgNovember 4, 2026

ALPHA HI-FILL 380

HI-FILL 380 underfill epoxy provides fast flow speed and low viscosity to protect BGA solder joints from drop stress.

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ALPHA HI-UV 5566T

HI-UV 5566T UV adhesive offers fast curing and high tensile strength for component fixing in electronics.

icon-lich.svgNovember 4, 2026

ALPHA HiTech SM42-1311

SM42-1311 surface mount adhesive offers fast curing and high thermal resistance for high-speed dispensing.

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ALPHA HiTech SM42-120P

Fast-curing surface mount adhesive offering excellent thermal resistance and non-sagging performance.

icon-lich.svgNovember 4, 2026

ALPHA HiTech AD43-9600W

AD43-9600W is a low viscosity, fast-curing epoxy adhesive for BLU lens bonding on Nylon, LCP, and metal substrates.

icon-lich.svgNovember 4, 2026

ALPHA HiTech EN21-4210F

High-hardness epoxy encapsulant providing excellent adhesion, waterproofing, and solder joint strength.

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ALPHA HiTech CU31-2030

Low viscosity, high Tg capillary underfill epoxy offering excellent reliability for BGA, CSP, and Flip Chip devices.

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ALPHA HiTech CU21-3240

High Tg, low CTE capillary underfill epoxy offering superior thermal cycling performance for PCB assemblies.

icon-lich.svgNovember 3, 2026

ALPHA HiTech CU13-3150

CU13-3150 is a fast low temperature cure underfill epoxy providing superior drop shock protection and reworkability.

icon-lich.svgNovember 3, 2026

ALPHA HiTech CU11-3127

ALPHA HiTech CU11-3127 provides high Tg and low CTE capillary underfill protection for board-level solder joints.

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