November 9, 2026 ALPHA HI-FILL 3150
ALPHA HI-FILL 3150 is a low viscosity one component epoxy adhesive formulated specifically to cure within a low-temperature range. Manufactured by MacDermid Alpha, this black paste adhesive is designed for bonding heat sensitive devices, ensuring strong mechanical attachment while protecting delicate electronic components from excessive thermal exposure.
Key Features and Advantages
Engineered for precision electronic manufacturing and underfill or encapsulation processes, ALPHA HI-FILL 3150 provides optimal flow characteristics alongside high process reliability. Key benefits include:
- One Component Epoxy: Ready-to-use formulation eliminates mixing errors and streamlines production workflows.
- Halogen-Free Compliance: Meets environmental safety standards for green electronics assembly.
- Low Viscosity: Features a low viscosity profile (1,000 to 3,000 cps) for excellent penetration and dispensing precision.
- Fast Low-Temperature Cure: Cures at 80 °C, minimizing thermal stress on temperature-sensitive components.
- Excellent Workability & Adhesion: Ensures superior substrate bonding with a reliable 3-day pot life at 25 °C.
Technical Specifications
Below is the technical properties overview for ALPHA HI-FILL 3150 based on official technical data:
| Property / Parameter | Value / Result |
|---|---|
| Chemical Type | Epoxy |
| Appearance | Black paste |
| Curing Method | Heat cure (30 minutes @ 80 °C recommended) |
| Viscosity (RVDV-II Brookfield #3, 20rpm @ 25 °C) | 1,000 to 3,000 cps |
| Specific Gravity | 1.1 to 1.2 |
| Pot Life (@ 25 °C) | 3 days |
| Shelf Life (@ -20 °C) | 6 months |
| Typical Applications | Adhesive for bonding heat sensitive devices |
Application and Curing Guidelines
ALPHA HI-FILL 3150 is ideal for adhesive applications requiring low viscosity flow and low temperature curing schedules. The recommended cure profile is 30 minutes at 80 °C in a convection oven. Optimal cure settings may vary depending on curing equipment, component mass, and specific process requirements.
Conclusion
For electronic manufacturing operations demanding low viscosity dispensing and reliable low-temperature cure performance, ALPHA HI-FILL 3150 delivers exceptional adhesion and component protection. For technical datasheet details or purchasing assistance, please get in touch with Contact – LORIOT INDUSTRIAL.
