November 4, 2026 ALPHA HiTech CU31-2030 Capillary Underfill Epoxy
ALPHA HiTech CU31-2030 is a high-reliability one-component capillary underfill epoxy designed for the protection of assembled chip packages onto printed circuit boards. Developed by MacDermid Alpha, this advanced formulation features low viscosity for fast flow properties alongside a high Tg and low modulus profile.
Key Features and Engineering Benefits
Specifically suitable for assembling BGA, CSP, and Flip Chip devices, this protective underfill material delivers a balanced set of performance advantages:
- Low viscosity formulation enabling fast and highly efficient capillary flow under component packages.
- High Glass Transition Temperature (Tg) combined with a low modulus structure for excellent long-term reliability.
- Room temperature flow capability, simplifying dispensing setup in SMT assembly lines.
- Fully halogen-free chemistry supporting sustainable and green electronic manufacturing.
- Complies strictly with global RoHS Directive 2015/863/EU environmental standards.
Application Parameters and Thermal Curing
Following exact storage, thawing, dispensing, and oven curing guidelines ensures maximum property development:
- Storage & Thawing: Freeze at ≤ -20°C in an upright position (tip facing bottom). Set syringe aside at room temperature for 2 hours to thaw completely before opening the cap; do not refreeze once thawed.
- Dispensing Parameters: Can be effectively dispensed under standard room temperature conditions without requiring complex preheating.
- Curing Profiles (Convection Oven): Achieve full property development by curing at 120°C for ≥ 20 minutes, 130°C for ≥ 10 minutes, or 150°C for ≥ 7.5 minutes.
Technical Specifications
Below is the detailed technical datasheet overview for microelectronic assembly engineering reference:
| Property | Specification / Requirement |
|---|---|
| Chemical Type | One-component Capillary Underfill Epoxy |
| Suitable Packages | BGA, CSP, Flip Chip |
| Primary Features | Low Viscosity, High Tg, Low Modulus, Room Temp Flow |
| Environmental Compliance | Halogen-Free, RoHS Directive 2015/863/EU |
| Storage Condition | ≤ -20°C (Upright position, tip facing bottom) |
| Thawing Requirement | 2 hours at room temperature |
| Dispensing Condition | Room temperature |
| Curing Options (Convection Oven) | 120°C (≥ 20 min) / 130°C (≥ 10 min) / 150°C (≥ 7.5 min) |
Conclusion
Integrating ALPHA HiTech CU31-2030 into SMT production guarantees superior protection and high reliability for BGA, CSP, and Flip Chip packaging. For technical support, volume purchasing, or dispensing assistance, please visit Contact – LORIOT INDUSTRIAL.
