October 29, 2026 ALPHA HiTech CF31-4010 Edgebond Epoxy
The ALPHA HiTech CF31-4010 is a high-performance, one-component, high filler content heat-curable edgebond epoxy developed by MacDermid Alpha. Specially formulated for corner bonding or edge bonding on BGA devices, this advanced material enhances the mechanical integrity of soldered component assemblies, enabling them to pass stringent reliability tests such as Drop Shock, Impact Bend, and Thermal Cycle (TCT).
Technical Features of ALPHA HiTech CF31-4010
In high-density printed circuit board manufacturing, protecting BGA solder joints from mechanical stress and thermal fatigue is crucial. Applying ALPHA HiTech CF31-4010 delivers superior structural reinforcement and thermal stability, making it an essential solution for demanding electronic applications.
Key Benefits and Properties
- High Glass Transition Temperature (Tg) for reliable elevated-temperature stability.
- Low Coefficient of Thermal Expansion (CTE) minimizing thermal stress on solder joints.
- Excellent Thermal Cycling performance under continuous operating conditions.
- Halogen-Free formulation supporting eco-friendly manufacturing requirements.
- Fully complies with RoHS Directive 2015/863/EU standards.
Because it dispenses effectively under standard ambient conditions, utilizing ALPHA HiTech CF31-4010 optimizes assembly line efficiency while offering long-term reliability for critical BGA components.
Application Guidelines
- Storage: Freeze at ≤ -20 °C to guarantee product stability. Store in an upright position with the syringe tip facing downward.
- Thawing: Remove the syringe from the freezer and set aside at room temperature for 2 hours. Do not open the cap before full thawing, and do not refreeze unused material. To prevent contamination, never return unused material to its original container.
- Application: Effectively dispense at standard room temperature conditions onto corners or edges of BGA devices.
- Curing: Achieve full property development in a convection oven using recommended schedules: ≥ 30 min @ 120 °C, ≥ 10 min @ 130 °C, or ≥ 7 min @ 150 °C.
Specifications & Curing Profile Table
| Parameter / Condition | Specification Details |
|---|---|
| Chemical Base | One-Component Epoxy (High Filler Content) |
| Application Method | Corner Bonding / Edge Bonding for BGA Devices |
| Thermal Properties | High Glass Transition Temp (Tg) / Low CTE |
| Environmental Compliance | Halogen-Free & RoHS Directive 2015/863/EU Compliant |
| Storage Condition | ≤ -20 °C (Upright position, tip facing bottom) |
| Thawing Requirement | 2 hours at room temperature prior to opening cap |
| Curing Condition: 120 °C | ≥ 30 minutes (Convection Oven) |
| Curing Condition: 130 °C | ≥ 10 minutes (Convection Oven) |
| Curing Condition: 150 °C | ≥ 7 minutes (Convection Oven) |
Conclusion
Integrating ALPHA HiTech CF31-4010 into your assembly line provides outstanding structural reinforcement for BGA components against severe physical and thermal shocks. For technical support, safety datasheets, or commercial volume quotes, please connect with us via Contact – LORIOT INDUSTRIAL.
