Electrolube ER2220 Epoxy Resin

Electrolube UVFlex

icon-lich.svg October 23, 2026

Overview of Electrolube UVFlex UV Cure Coating

The Electrolube UVFlex sets a new benchmark in UV-cure conformal coating technology for demanding electronic applications. Developed and manufactured by MacDermid Alpha, this solvent-free formulation successfully addresses the performance gap between conventional urethane acrylate UV coatings and traditional solvent-based alternatives. It provides high elasticity and ensures long-term protection of sensitive electronic assemblies operating in extremely harsh environmental conditions.

Key Attributes of Electrolube UVFlex

To maintain electrical and mechanical reliability under extreme stress, this conformal coating integrates fast curing capabilities with exceptional physical resilience. The primary advantages include:

  • Superior Thermal Cycling: Proven to withstand more than 1,000 rigorous thermal cycles from -40°C to +125°C without compromising structural integrity.
  • Safe and Sustainable: A 100% solids, single-component formulation that contains zero solvents, PFAS, or silicone. Furthermore, it incorporates 25% to 30% bio-based content from sustainable sources.
  • High Surface Insulation Resistance (SIR): Delivers improved SIR performance, particularly in damp heat environments, preventing electrical leakage and short circuits.
  • Thixotropic Properties: The unique rheology ensures superior component edge coverage, securely encapsulating sharp leads and complex geometries.

Technical Specifications

Understanding the operational parameters is crucial for engineers optimizing their selective coating processes. Below are the core specifications of the product:

Property / Feature Value / Details
Product Type Single-component UV cure conformal coating
Operating Temperature Range -40°C to +150°C
Thermal Cycling Resistance > 1,000 cycles (-40°C to +125°C)
Solid Content 100% (Solvent-free)
Flame Retardancy UL 94 V-0 recognized (approval pending)

Conclusion

By utilizing Electrolube UVFlex in your assembly process, you can achieve rapid curing times while drastically improving the thermal and environmental resilience of your PCBs. Its sustainable, solvent-free nature combined with superior edge coverage makes it an ideal solution for modern high-reliability manufacturing. For technical datasheets, pricing, or application support, please reach out to our team at Contact – LORIOT INDUSTRIAL.


Related products

HT-1331S

High-viscosity surface mount adhesive designed for fast heat curing, wave soldering, and high-speed dispensing.

HT-130S

Fast heat-curable surface mount adhesive designed for high-speed dispensing and wave soldering applications.

HI-POXY 9100

9100 is a low-temperature heat-cure epoxy coating that reinforces solder joints and protects IC devices from drop damage.

ALPHA UNIQUE 3075YHF

3075YHF is a reworkable, halogen-free underfill epoxy designed to improve BGA attachment strength.

ALPHA HT-130DM

HT-130DM is a fast heat-curable surface mount adhesive designed for high-speed dispensing and wave soldering.

ALPHA HT-130DL

HT-130DL is a fast heat-curable surface mount adhesive for high-speed dispensing and screen printing in wave soldering.

ALPHA HiTech UP44-5566T

UP44-5566T is a fast-curing UV adhesive designed for coating and fixing electronic components securely.

ALPHA HiTech UP44-5311F

UP44-5311F is a fast UV-cure encapsulant designed to reinforce solder joints and prevent IC chip cracking.

ALPHA HiTech UNIQUE 3075BHF

Halogen-free underfill epoxy designed to improve BGA attachment strength.

ALPHA HiTech CU32-380

CU32-380 is a low-viscosity capillary underfill providing impact resistance and solder joint stress relief.

ALPHA HiTech CF41-20000S-B(L)

One-component edgebond epoxy cured during Pb-free reflow to protect solder...

ALPHA HiTech CF31-4026

CF31-4026 is a reworkable, halogen-free edgebond epoxy designed for high thermal cycling reliability in electronics.

ALPHA HITECH AD13-9100A

One component halogen-free low temperature adhesive designed for bonding various substrates.

ALPHA HI-FILL 3150

3150 is a one component halogen-free low viscosity epoxy adhesive designed for heat sensitive electronic devices.

ALPHA HI-POXY 9600W

HI-POXY 9600W is a one component halogen-free epoxy adhesive designed for bonding heat sensitive electronic devices.

ALPHA HI-POXY 9554W

HI-POXY 9554W is a one component halogen-free epoxy adhesive designed for bonding heat sensitive electronic devices.

ALPHA HI-POXY 9490TM

9490TM is a one component halogen-free epoxy adhesive designed for bonding heat sensitive devices.

ALPHA HI-POXY 9490BM

One component halogen-free epoxy adhesive designed for bonding heat sensitive electronic devices.

ALPHA HI-POXY 4007B

HI-POXY 4007B is a one component halogen-free epoxy adhesive designed to improve mechanical attachment strength.

ALPHA HI-FILL 3100

Underfill epoxy features high Tg, low CTE, and fast flow-speed for BGA solder joint mechanical protection.

ALPHA HI-FILL 380

HI-FILL 380 underfill epoxy provides fast flow speed and low viscosity to protect BGA solder joints from drop stress.

ALPHA HI-UV 5566T

HI-UV 5566T UV adhesive offers fast curing and high tensile strength for component fixing in electronics.

ALPHA HiTech SM42-1311

SM42-1311 surface mount adhesive offers fast curing and high thermal resistance for high-speed dispensing.

ALPHA HiTech SM42-120P

Fast-curing surface mount adhesive offering excellent thermal resistance and non-sagging performance.

ALPHA HiTech AD43-9600W

AD43-9600W is a low viscosity, fast-curing epoxy adhesive for BLU lens bonding on Nylon, LCP, and metal substrates.

ALPHA HiTech EN21-4210F

High-hardness epoxy encapsulant providing excellent adhesion, waterproofing, and solder joint strength.

ALPHA HiTech CU31-2030

Low viscosity, high Tg capillary underfill epoxy offering excellent reliability for BGA, CSP, and Flip Chip devices.

ALPHA HiTech CU21-3240

High Tg, low CTE capillary underfill epoxy offering superior thermal cycling performance for PCB assemblies.

ALPHA HiTech CU13-3150

CU13-3150 is a fast low temperature cure underfill epoxy providing superior drop shock protection and reworkability.

ALPHA HiTech CU11-3127

ALPHA HiTech CU11-3127 provides high Tg and low CTE capillary underfill protection for board-level solder joints.

ALPHA HiTech CF31-4010

CF31-4010 edgebond epoxy strengthens BGA solder joints against drop shock, impact, and thermal cycling.

ALPHA HiTech CF12-4485B

HiTech CF12-4485B edgebond epoxy offers low-temperature curing and protects solder joints from stress.

ALPHA HiTech AD13-9692B Epoxy

Provides fast low-temperature curing for heat-sensitive component bonding.

Electrolube UR5634 Polyurethane Resin

Optically clear, semi-rigid encapsulant with high UV and weather resistance.

Electrolube UR5604 Polyurethane Potting

Offers UL94 V-0 flame retardancy and low viscosity for component encapsulation.

Electrolube UR5097 Polyurethane Resin

Offers high thermal conductivity and UL94 V-0 flame retardancy for electronics.

Electrolube ER2223 Epoxy Resin

Low viscosity, high Tg encapsulation resin designed for extreme heat resistance.

Electrolube ER2220 Epoxy Resin

Delivers high thermal conductivity and UL94 V-0 flame retardancy for LED...

Electrolube ER2188 Epoxy Compound

Provides cost-effective, flame-retardant potting and encapsulation for electronics.

Electrolube UR9001 Polyurethane Potting

Foam provides lightweight, flame-retardant encapsulation for EV battery packs.

Electrolube TCOR Thermally Conductive

Silicone offers high bond strength and efficient heat dissipation for components.

Electrolube HTSP Heat Transfer

Silicone paste delivers 3.0 W/m.K thermal conductivity over a wide temperature...

Electrolube HTS Heat Transfer

Provides efficient thermal conductivity over a wide temperature range for electronics.

Electrolube HTCP Heat Transfer

Offers high thermal conductivity and non-silicone protection electronic components.

Electrolube HTC Heat Transfer

Non-silicone, cost-effective thermal compound for reworkable electronics.

Electrolube GFP850

Electrolube GFP850 thermal pad by MacDermid Alpha. Offers high 8.5 W/m-K conductivity and low compression.

Electrolube GFP500NS

Electrolube GFP500NS thermal pad by MacDermid Alpha. Silicone-free, 5.0 W/m-K conductivity, low compression.

Electrolube GFP500

Electrolube GFP500 thermal pad by MacDermid Alpha. Offers high 5.0 W/m-K conductivity and low compression force.

Electrolube GFP150FG

Electrolube GFP150FG thermal pad by MacDermid Alpha. Offers 1.5 W/m-K conductivity and fiberglass strength.

Electrolube UVCL

Electrolube UVCL. This VOC-free, single-part UV cure coating offers dual cure technology and maximum PCB protection.

Electrolube 2K301P

Discover the Electrolube 2K301P. This two-component polyurethane coating provides extreme flexibility and moisture resistance.

Sign Up To Get Latest Updates

Template: single-product.php