August 26, 2026 ALPHA WS-698 Flux for Area Array Packaging
The ALPHA WS-698 Flux is a high-activity water-soluble paste flux engineered for soldering a variety of lead-free and tin-lead eutectic alloys onto area array packages. Formulated to offer superior wetting on tough substrate finishes, it effectively reduces missing ball rates while ensuring low voiding performance in advanced semiconductor packaging applications. Learn more about the manufacturer on the MacDermid Alpha official site.
ALPHA WS-698 Flux Key Features and Performance Benefits
Designed for demanding microelectronic and semiconductor assembly, ALPHA WS-698 provides significant operational advantages:
- Broad Alloy & Finish Compatibility: Excels on Copper Organic Solderability Preservative (Cu-OSP), electrolytic Nickel-Gold (Ni-Au), and Electroless Nickel/Immersion Gold (ENIG) pad finishes.
- High Activity & Low Voiding: Delivers exceptional fluxing activity, outstanding solder spread, and low voiding performance for robust interconnects.
- Improved Yields: Minimizes missing ball rates and increases overall production yields during ball attach and area array reflow processes.
- Halogen-Free & Water-Soluble: Fully halogen-free composition allows straightforward water cleaning to completely remove flux residues after processing.
ALPHA WS-698 Flux Technical Specifications
| Parameter | Specification |
|---|---|
| Product Name | ALPHA WS-698 |
| Flux Form | Water-Soluble Paste Flux |
| Halogen Content | Halogen-Free |
| Alloy Compatibility | Lead-Free and Eutectic Tin-Lead (Sn-Pb) Alloys |
| Surface Finish Compatibility | Cu-OSP, Ni-Au (Electrolytic), ENIG |
| Cleaning Method | Water Washable |
Conclusion
Implementing ALPHA WS-698 Flux in your packaging lines guarantees reliable solder joint formation, low voiding levels, and high production yields. For technical assistance, pricing, or product availability, please reach out via Contact – LORIOT INDUSTRIAL.
