Kester 959T Flux for Wave Soldering Applications
The Kester 959T Flux is a high-grade no-clean, non-corrosive liquid flux engineered for wave soldering conventional and surface mount circuit board assemblies. Classified as ORL0, this specialized formula is designed to minimize micro-solderball formation during wave soldering operations. Learn more about advanced electronics assembly solutions at Kester.
Key Features of Kester 959T Flux
Engineered for high-reliability assembly processes, this solvent-based flux delivers key manufacturing benefits:
- 0.5% Rosin Content: Contains a small percentage of rosin (0.5%) that enhances solderability, heat stability, and surface insulation resistance.
- Micro-Solderball Reduction: Specifically formulated to restrict the formation of micro-solderballs during wave soldering.
- Superior Joint Aesthetics: Provides optimal wetting performance and creates exceptionally shiny solder joints for solvent-based no-clean chemistries.
- Uniform Residue Distribution: Leaves evenly distributed, non-corrosive residues for superior cosmetic appearance post-soldering.
Optimized for High-Precision Electronics Manufacturing
Integrating Kester 959T Flux into wave soldering lines reduces micro-solderballing issues on densely packed circuit boards. Its balanced rosin addition reinforces thermal endurance throughout the heating cycle without compromising board cleanliness or post-process electrical performance.
Technical Specifications
| Property | Specification |
|---|---|
| Product Name | Kester 959T |
| Flux Type | Liquid, Solvent-Based, No-Clean, Non-Corrosive |
| Flux Classification | ORL0 |
| Rosin Content | 0.5% Rosin |
| Primary Application | Wave Soldering (Conventional & SMT Assemblies) |
| Key Benefit | Minimizes Micro-Solderballs, High Heat Stability |
Conclusion
Deploying Kester 959T Flux ensures reliable solder wetting, minimal micro-solderball defect rates, and pristine joint aesthetics. For official supply details and technical support, please visit Contact – LORIOT INDUSTRIAL.

