Kester 186 Flux-Pen RMA Rosin Soldering Pen

Kester 186 Flux-Pen® is specifically designed for leaded and lead-free rework of conventional and surface mount circuit board assemblies. Manufactured by Kester, this specialized flux pen delivers precise application and high thermal stability required for demanding multi-layer electronics assembly and repair.

Technical Features of Kester 186 Flux-Pen

Under the former MIL-F-14256 specification, Kester 186 was QPL approved as Type RMA. Although its fluxing ability approaches that of Type RA flux, the residues left after soldering remain strictly non-corrosive and non-conductive, ensuring long-term circuit integrity.

Developed for critical applications where difficult assemblies must be soldered under Type RMA process mandates, this formulation withstands high preheat temperatures required for multi-layer boards. Furthermore, exposure to elevated thermal processing does not degrade the solubility of the residue in normal cleaning solvents, and there is no degradation of surface insulation resistance (SIR).

Key Product Highlights

• Versatile Application: Engineered for both leaded and lead-free rework on conventional and surface mount assemblies (SMT).
• RMA Performance: QPL approved as Type RMA under former MIL-F-14256 with fluxing activity approaching Type RA.
• High Thermal Stability: Withstands high preheating and soldering temperatures necessary for multi-layer PCB processing.
• Safe Residues: Non-corrosive, non-conductive, moisture-resistant, and fungus-resistant residue with minimal ionic activators.

Product Specifications

Conclusion

Combining precise pen delivery with high thermal stability and non-corrosive residue safety, Kester 186 Flux-Pen provides exceptional rework efficiency for multi-layer circuit assemblies. For technical support or product sourcing, please visit Contact – LORIOT INDUSTRIAL.