August 14, 2026 Eliminating silicone contamination during electronics assembly is crucial for preserving solderability and reducing manufacturing defects. (Product# 1978 / 1978-DP, 1978-1) provides high-performance thermal transfer between heat-generating components and cooling hardware without the risk of silicone migration.
What is Silicone-Free Heat Sink Compound 1978?
Silicone-Free Heat Sink Compound 1978 is a premium thermal interface paste manufactured by Techspray. Specially formulated as a non-silicone gray paste, it fills micro-air gaps between electronic components and mechanical heat sinks to maximize heat dissipation while preventing silicone-induced solder defects in sensitive manufacturing environments.
Key Features and Benefits
- No Silicone Contamination: Eliminates silicone migration that degrades solderability and causes solder defects on adjacent circuitry.
- High Thermal Conductivity: Delivers an impressive 0.92 W/m-K thermal conductivity rating for efficient heat transfer.
- Wide Functional Temperature Range: Operates reliably from -40°F to 392°F (-40°C to 200°C).
- Stable Formula: Will not separate, harden, or crack over extended operational lifespans.
- Easy Application & Environmentally Safe: Smooth paste consistency for easy dispensing; non-ozone depleting formulation.
Target Applications
The absence of silicone makes Silicone-Free Heat Sink Compound 1978 the preferred choice in contamination-sensitive electronic and electrical applications, including:
- PCB Assembly & Wave Soldering: Thermally bonding components where silicone fumes or residues could compromise nearby solder joints.
- Thermocouple Wells & Thermistors: Facilitating precise thermal contact for temperature-sensing instruments.
- Heating Elements & Calrods: Transferring heat efficiently in industrial heating units and heavy electrical assemblies.
Application Guidelines
1. Surface Preparation
Clean both the component surface and the heat sink interface to remove dust, oil, or previous thermal material residues. Ensure all surfaces are completely dry before application.
2. Dispensing Process
Apply a thin, even coat of paste to the contact area. Press the heat-generating component firmly onto the mechanical heat sink to disperse trapped air. A thin, uniform layer ensures optimal thermal conductivity.
Technical Specifications
| Property | Specification |
|---|---|
| Product Name / Part Numbers | Silicone-Free Heat Sink Compound / 1978-DP (4 oz. tube), 1978-1 (1 lb. jar) |
| Physical State / Color | Solid (Paste) / Gray |
| Thermal Conductivity | 0.92 W/m-K |
| Functional Temperature Range | -40°F to 392°F (-40°C to 200°C) |
| Flash Point (Closed Cup) | 564.8ºF (296ºC) |
| Boiling Point | 399.2ºF (204ºC) |
| Vapor Pressure | 0.013 kPa (0.1 mmHg) |
| Evaporation Rate (butyl acetate = 1) | 0.01 |
| Environmental Safety | Non-Ozone Depleting |
| Shelf Life | 5 Years |
Conclusion & Support
For high-efficiency heat dissipation without the risk of silicone contamination, Silicone-Free Heat Sink Compound 1978 is the ideal industrial thermal paste. For technical assistance, pricing, or product availability, please visit Contact – LORIOT INDUSTRIAL to reach our specialist team.
