November 3, 2026 ALPHA HiTech CU13-3150 Capillary Underfill Epoxy
ALPHA HiTech CU13-3150 is a premium one-component low-temperature thermal cure capillary underfill epoxy designed for PCB assembly applications. Manufactured by MacDermid Alpha, this material enhances mechanical strength and protects assembled chip packages on printed circuit boards.
Key Features and Engineering Benefits
Engineered for high-performance microelectronic applications requiring low temperature curing and easy repairability, this material provides outstanding mechanical protection:
- Low viscosity formulation enabling rapid capillary flow under low clearance chip packages.
- Fast curing capability at low temperatures to protect heat-sensitive electronic components.
- Excellent adhesion strength and superior drop shock performance against mechanical impact.
- Reworkable chemistry allowing straightforward board repair and component replacement.
- Fully halogen-free formulation compliant with global RoHS Directive 2015/863/EU environmental standards.
Application and Thermal Curing Guidelines
Strict adherence to storage, thawing, and curing parameters ensures optimal material stability and property development:
- Storage & Thawing: Freeze at < -20°C in an upright position (tip facing bottom). Set syringe aside at room temperature for 2 hours to thaw completely before opening the cap; do not refreeze after thawing.
- Dispensing Parameters: Dispenses effectively under standard room temperature conditions.
- Curing Profiles (Convection Oven): Cure at 80°C for ≥ 30 minutes, 100°C for ≥ 10 minutes, 110°C for ≥ 7 minutes, or 120°C for ≥ 5 minutes.
Technical Specifications
Below is the detailed technical datasheet overview for assembly process development:
| Property | Specification / Requirement |
|---|---|
| Chemical Type | One-component Capillary Underfill Epoxy |
| Primary Features | Low Viscosity, Fast Low-Temp Cure, Reworkable, Halogen-Free |
| Environmental Compliance | RoHS Directive 2015/863/EU |
| Storage Condition | < -20°C (Upright position, tip facing bottom) |
| Thawing Requirement | 2 hours at room temperature |
| Dispensing Condition | Room temperature |
| Curing Options (Convection Oven) | 80°C (≥ 30 min) / 100°C (≥ 10 min) / 110°C (≥ 7 min) / 120°C (≥ 5 min) |
Conclusion
Utilizing ALPHA HiTech CU13-3150 ensures superior drop shock resistance and reworkability for temperature-sensitive PCB chip package assemblies. For technical assistance, dispensing equipment support, or volume quotes, please visit Contact – LORIOT INDUSTRIAL.
