November 3, 2026 ALPHA HiTech CU21-3240 Capillary Underfill Epoxy
ALPHA HiTech CU21-3240 is a high-reliability one-component capillary underfill epoxy engineered to protect assembled chip packages on printed circuit boards. Developed by MacDermid Alpha, this advanced formulation features a high Tg and low CTE profile to deliver outstanding structural protection against environmental stresses.
Key Features and Engineering Benefits
Designed for demanding microelectronic packaging applications, this protective underfill material delivers key performance advantages:
- High Glass Transition Temperature (Tg) combined with a Low Coefficient of Thermal Expansion (CTE).
- Excellent thermal cycling performance, preventing solder joint failure under continuous temperature fluctuations.
- Robust resistance against mechanical stresses to enhance overall board-level assembly reliability.
- Fully halogen-free formulation supporting green electronic manufacturing practices.
- Complies strictly with global RoHS Directive 2015/863/EU standards.
Application Parameters and Thermal Curing
Following precise handling, preheating, and oven curing guidelines is critical for optimal material property development:
- Storage & Thawing: Freeze at ≤ -20°C in an upright position (tip facing bottom). Set syringe aside at room temperature for 2 hours to thaw completely before opening the cap; do not refreeze after thawing.
- Substrate Preheat & Dispensing: For fast and effective capillary flow beneath the component package, apply a substrate preheat temperature between 70°C and 100°C during dispensing.
- Curing Profiles (Convection Oven): Achieve full property development by curing at 140°C for ≥ 30 minutes, 150°C for ≥ 10 minutes, or 165°C for ≥ 5 minutes.
Technical Specifications
Below is the detailed technical datasheet summary for process development and engineering reference:
| Property | Specification / Requirement |
|---|---|
| Chemical Type | One-component Capillary Underfill Epoxy |
| Primary Properties | High Tg, Low CTE, Excellent Thermal Cycling |
| Environmental Compliance | Halogen-Free, RoHS Directive 2015/863/EU |
| Storage Condition | ≤ -20°C (Upright position, tip facing bottom) |
| Thawing Time | 2 hours at room temperature |
| Substrate Preheat Temp | 70 °C to 100 °C |
| Curing Options (Convection Oven) | 140°C (≥ 30 min) / 150°C (≥ 10 min) / 165°C (≥ 5 min) |
Conclusion
Integrating ALPHA HiTech CU21-3240 into your assembly process guarantees exceptional thermal cycling resilience and mechanical protection for high-density chip packages. For technical assistance, dispensing parameters, or volume quotes, please visit Contact – LORIOT INDUSTRIAL.
