November 4, 2026 ALPHA HI-FILL 380 Underfill Epoxy
ALPHA HI-FILL 380 is a high-performance one-component underfill epoxy designed to improve the attachment strength of BGA components and protect solder joints during severe mechanical stress, such as drop impact and board bending. Manufactured by MacDermid Alpha, this advanced formulation ensures maximum structural integrity in modern microelectronic assemblies.
Key Features of ALPHA HI-FILL 380
Engineered for high-density surface mount technology and component protection, this liquid epoxy offers exceptional capillary action and thermal cure characteristics. The primary engineering benefits of ALPHA HI-FILL 380 include:
- Low Viscosity & Excellent Flow-Speed: Features a low viscosity profile (300 to 800 cps) that enables rapid capillary flow under low-clearance BGA packages.
- Mechanical Joint Protection: Significantly absorbs drop, shock, and flexural stress to prevent solder joint cracking and fatigue failure.
- One-Component Formulation: Ready-to-use single-component epoxy liquid eliminating complex mixing procedures.
- Halogen-Free Chemistry: Environmentally friendly composition supporting global green electronics manufacturing standards.
Application Guidelines and Thermal Curing
Following correct cold storage, thawing, and thermal curing protocols ensures optimal underfill penetration and complete property development when utilizing ALPHA HI-FILL 380:
- Storage & Shelf Life: Store at -20°C to guarantee product stability for up to 6 months. Pot life at 25°C room temperature condition is 3 days.
- Packaging & Handling: Supplied in specified syringes or bulk containers per customer request. Syringes must be allowed to thaw completely to room temperature before opening caps to avoid moisture condensation.
- Recommended Cure Profile: Cure in a convection oven at 130°C for a minimum of 8 minutes. Optimal curing parameters may vary slightly based on assembly thermal mass and specific customer equipment setups.
Technical Specifications
Below is the detailed technical datasheet summary for process engineering and SMT production reference:
| Property | Specification / Requirement |
|---|---|
| Chemical Type | Epoxy System |
| Appearance | Black liquid |
| Curing Method | Heat cure (Convection Oven) |
| Typical Applications | BGA Underfill, mechanical joint protection |
| Viscosity (RVDV-II Brookfield #4, 20rpm, @25 °C) | 300 to 800 cps |
| Specific Gravity | 1.1 to 1.2 |
| Pot Life (@ 25 °C) | 3 days |
| Shelf Life (@ -20 °C) | 6 months |
| Recommended Cure Condition | 8 minutes @ 130 °C (Convection oven) |
| Environmental Compliance | Halogen-Free |
Conclusion
Utilizing ALPHA HI-FILL 380 guarantees fast underfill capillary flow and superior mechanical shock protection for BGA components during rigorous product life cycles. For technical support, dispensing setup, or commercial quotes, please visit Contact – LORIOT INDUSTRIAL.
