November 4, 2026 ALPHA HI-POXY 9490TM
ALPHA HI-POXY 9490TM is a specialized one component epoxy adhesive specifically formulated to cure within a low-temperature range. Developed by MacDermid Alpha, this light brown paste adhesive is designed for bonding heat sensitive devices, offering rapid low-temperature curing to prevent thermal damage to delicate electronic components during assembly.
Key Features and Advantages
Engineered for high-precision electronic manufacturing, ALPHA HI-POXY 9490TM delivers fast thermal processing alongside exceptional substrate adhesion. Primary benefits include:
- One Component Epoxy: Pre-mixed, single-component system for streamlined application and uniform quality control.
- Halogen-Free Compliance: Fully aligned with modern international environmental and safety standards for clean electronics production.
- Fast Low-Temperature Cure: Efficiently cures at low temperatures, minimizing thermal stress on temperature-sensitive components.
- Excellent Workability & Adhesion: Maintains precise thixotropic flow characteristics for consistent dispensing and robust structural bonding.
Technical Specifications
Below is the technical properties overview for ALPHA HI-POXY 9490TM based on official technical data:
| Property / Parameter | Value / Result |
|---|---|
| Chemical Type | Epoxy |
| Appearance | Light brown paste |
| Curing Method | Heat cure (> 5 min @ 80 °C recommended) |
| Samsung Electronics Cure Condition | > 200 minutes @ 90 °C (Hot-bar) |
| Viscosity (Malcom PC-10A, 30rpm @ 25 °C) | 10,000 to 25,000 cps |
| Thixotropic Index | 4.0 to 6.0 |
| Specific Gravity | 1.1 to 1.3 |
| Pot Life (@ 25 °C) | 3 days |
| Shelf Life (@ -20 °C) | 6 months |
| Typical Applications | Adhesive for bonding heat sensitive devices |
Application and Curing Guidelines
ALPHA HI-POXY 9490TM is ideal for adhesive applications where components cannot tolerate high curing temperatures. The recommended thermal cure schedule is greater than 5 minutes at 80 °C in a convection oven, or greater than 200 minutes at 90 °C for hot-bar processes. Actual cure profiles may vary depending on component mass, board geometry, and specific thermal equipment performance.
Conclusion
For electronic assemblies requiring reliable low-temperature bonding of sensitive components, ALPHA HI-POXY 9490TM provides superior adhesion strength and thermal protection. For technical inquiries, product packaging options, or purchasing details, please reach out to Contact – LORIOT INDUSTRIAL.
