HT-1331S

ALPHA HT-130DL

icon-lich.svg November 9, 2026

ALPHA HT-130DL Surface Mount Adhesive

ALPHA HT-130DL is a one-component, intermediate-temperature, fast heat-curable surface mount adhesive designed for high-speed dispensing and screen printing applications. Developed by MacDermid Alpha, this epoxy-based red paste provides excellent productivity in wave-soldering processes. Electronics manufacturers rely on ALPHA HT-130DL for securing surface-mount components accurately on printed circuit board (PCB) assemblies prior to wave soldering.

Key Features and Benefits of ALPHA HT-130DL

This high-performance epoxy surface mount adhesive offers process stability and excellent workability for modern circuit assembly lines:

  • Fast Heat Curing: Cures quickly at intermediate temperatures to maximize line productivity.
  • Excellent Thermal Resistance: Maintains structural integrity and high bond strength during wave soldering thermal spikes.
  • Non-Sagging Profile: Features a high thixotropic index (> 4.0) to maintain crisp dot profiles and prevent slumping.
  • Excellent Workability: Formulated for stable performance in both high-speed automated dispensing and screen printing operations.
  • One-Component Formulation: Supplied as a ready-to-use red paste in various syringe packaging options.

Processing Guidelines and Curing Conditions

Applying ALPHA HT-130DL on assembly lines allows operators to maintain high throughput and consistent dot geometry. The material uncured features a viscosity of 500 to 600 Poise (Malcom PC-10A, 30 rpm @ 25 °C), a pot life of 7 days at 25 °C, and a shelf life of 6 months when stored at 1 to 10 °C. Full property development is achieved in a convection oven using recommended curing profiles, such as 120 seconds at 120 °C or 80 seconds at 150 °C.

Technical Specifications

Category / Parameter Specification Details
Chemistry & Appearance Epoxy (Red paste)
Application Methods High-speed Dispenser & Screen Print
Viscosity @ 25 °C 500 to 600 Poise (Malcom PC-10A, 30 rpm)
Thixotropic Index / Specific Gravity > 4.0 / 1.0 to 1.4
Pot Life / Shelf Life 7 days @ 25 °C / 6 months @ 1 to 10 °C
Convection Oven Curing Options 120 seconds @ 120 °C or 80 seconds @ 150 °C

Conclusion

In summary, ALPHA HT-130DL delivers a fast-curing, reliable surface mount adhesive solution tailored for wave-soldering processes in high-density electronics assembly. For technical datasheets, commercial quotes, or application support, please contact us via Contact – LORIOT INDUSTRIAL.


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