November 9, 2026 HI-POXY 9100 Epoxy Coating Protection
HI-POXY 9100 is a one-component, heat-curable epoxy coating designed to improve the attachment strength of solder joints and protect IC devices from dropping out due to mechanical stress. Manufactured by MacDermid Alpha, this black epoxy offers low-temperature curing starting at 70 °C to safeguard heat-sensitive electronic components. Electronics manufacturers choose HI-POXY 9100 for coating and potting applications that require high adhesion, low moisture absorption, and halogen-free compliance.
Key Features and Benefits of HI-POXY 9100
This high-reliability protective epoxy delivers process efficiency and mechanical protection tailored for printed circuit board (PCB) assembly:
- Low-Temperature Heat Cure: Fully cures at ≥ 70 °C for 20 minutes, minimizing thermal strain on delicate electronic packages.
- Strong Mechanical Adhesion: Enhances solder joint attachment to prevent component detachment under vibration or drop impacts.
- Excellent Moisture Resistance: Maintains low moisture absorption (≤ 1.0 wt% after 24 hours immersion at 25 °C) for reliable insulation.
- Long Shelf and Pot Life: Provides a 7-day pot life at 25 °C and a 6-month shelf life when stored at -20 °C.
- Halogen-Free Formulation: Meets global environmental safety standards without compromising mechanical strength.
Processing Guidelines and Curing Conditions
Dispensing HI-POXY 9100 is effectively carried out using standard coating equipment. The uncured black material exhibits a controlled viscosity of 1,000 to 3,000 cps (Brookfield Cone & Plate, 52 spindle @ 25 °C) and a specific gravity of 1.1 to 1.2. Optimum cure conditions in a convection oven require a minimum profile of 20 minutes at 70 °C. Actual thermal profiles may vary depending on curing equipment, PCB mass, and specific process requirements.
Technical Specifications
| Category / Parameter | Specification Details |
|---|---|
| Chemistry & Appearance | One-component Epoxy (Black liquid) |
| Viscosity @ 25 °C | 1,000 ~ 3,000 cps (Brookfield Cone & Plate, 52 spindle, 20 rpm) |
| Specific Gravity | 1.1 to 1.2 |
| Pot Life / Shelf Life | 7 days @ 25 °C / 6 months @ -20 °C |
| Convection Oven Cure Profile | ≥ 20 minutes @ 70 °C |
| Glass Transition Temperature (Tg) / Hardness | 23 (± 5) °C (TMA) / 25 to 35 (Shore D) |
| Coefficient of Thermal Expansion (CTE) | α1: 48 (± 15) ppm / α2: 220 (± 25) ppm |
| Environmental Standards | Halogen-free compliance, Moisture absorption ≤ 1.0 wt% |
Conclusion
In summary, HI-POXY 9100 provides an effective, low-temperature epoxy coating solution to reinforce solder joint integrity and protect critical IC devices against drop impact. For technical datasheets, product availability, or commercial quotes, please get in touch via Contact – LORIOT INDUSTRIAL.
