November 10, 2026 HT-130S Surface Mount Adhesive Solution
HT-130S is a one-component, intermediate-temperature, fast heat-curable surface mount adhesive engineered for high-speed dispensing and screen printing applications. Manufactured by MacDermid Alpha, this epoxy-based red paste provides exceptional productivity in wave-soldering processes. Electronics manufacturers select HT-130S for securing surface-mount components precisely on printed circuit board (PCB) assemblies prior to wave soldering.
Key Features and Benefits of HT-130S
This high-performance surface mount adhesive delivers a balanced set of processing and mechanical properties tailored for modern SMT manufacturing lines:
- Fast Heat Curing: Rapidly cures at intermediate temperatures, such as 80 seconds at 150 °C in a convection oven.
- Excellent Thermal Resistance: Maintains high bond strength and structural integrity during wave soldering thermal spikes.
- Non-Sagging Profile: Features a high thixotropic index (≥ 4.0) to maintain crisp dot profiles and prevent slumping.
- High Electrical Insulation: Delivers superior insulation resistance (≥ 1 x 10¹² Ω) and zero corrosion after extended humidity testing.
- Low Moisture Absorption: Keeps moisture absorption under ≤ 1.0 wt% after 24 hours immersion at 40 °C to preserve circuit performance.
Processing Guidelines and Curing Conditions
Applying HT-130S on assembly lines enables operators to achieve consistent dot geometry and high production speeds. Uncured, this red paste exhibits a viscosity of 500 to 600 Poise (Malcom PC-10A, 30 rpm @ 25 °C), a pot life of 7 days at 25 °C, and a shelf life of 6 months when stored between 1 and 10 °C. Recommended cure conditions in a convection oven require a profile of 80 seconds at 150 °C, though optimal conditions may vary based on equipment and substrate mass.
Technical Specifications
| Category / Parameter | Specification Details |
|---|---|
| Chemistry & Appearance | Epoxy (Red paste) |
| Application Methods | High-speed Dispenser & Screen Print |
| Viscosity @ 25 °C | 500 to 600 Poise (Malcom PC-10A, 30 rpm) |
| Thixotropic Index / Specific Gravity | ≥ 4.0 / 1.0 to 1.4 |
| Pot Life / Shelf Life | 7 days @ 25 °C / 6 months @ 1 to 10 °C |
| Convection Oven Curing Profile | 80 seconds @ 150 °C |
| Glass Transition Temp (Tg) / Hardness | ≥ 100 °C (DSC) / 80 to 90 (Shore D) |
| Electrical Insulation & Corrosion | Insulation Resistance ≥ 1 x 10¹² Ω; Corrosion: None |
Conclusion
In summary, HT-130S provides a fast-curing, reliable surface mount adhesive solution tailored for wave-soldering operations in high-density electronics manufacturing. For technical datasheets, commercial quotes, or product support, please contact us via Contact – LORIOT INDUSTRIAL.
