September 7, 2026 Kester R276 Solder Paste for Precision Dispensing
Kester R276 Solder Paste is a high-performance no-clean formulation specifically engineered to deliver optimal flow characteristics in all types of dispensing applications. Developed by Kester, this specialized paste provides exceptional consistency across various needle gauge sizes, making it an ideal choice for targeted electronic assembly and repair processes.
Key Features of R276 Solder Paste
Designed for automated and manual syringe dispensing, this versatile no-clean paste delivers distinct operational advantages:
- Optimized rheology providing smooth, continuous flow through a wide range of dispensing needle diameters.
- No-clean flux formulation classified as ROL0 under IPC standards, leaving safe, non-corrosive residues.
- Available in both leaded (Sn63Pb37) and lead-free (Sn96.5Ag3.0Cu0.5 / SAC305) alloy choices.
- Prevents needle clogging and dot stringing for precise deposit volumes during high-speed dispensing.
Technical Specifications and Alloy Options
Selecting the proper alloy and flux combination is essential for achieving reliable solder joints in localized assembly. Utilizing Kester R276 Solder Paste ensures accurate deposit placement and robust thermal performance across diverse manufacturing setups.
| Technical Parameter | Specification Details |
|---|---|
| Flux Classification | ROL0 (IPC J-STD-004) |
| Cleaning Requirement | No-Clean |
| Available Alloys | Sn63Pb37 (Leaded) & Sn96.5Ag3.0Cu0.5 (Lead-Free / SAC305) |
| Application Method | Syringe / Pneumatic Dispensing |
| Dispensing Capability | Compatible with a wide range of needle gauge sizes |
Conclusion
Streamlining fine-dot dispensing and targeted rework in electronic manufacturing is efficient with Kester R276 Solder Paste. For technical datasheets, alloy availability, or procurement support, please connect with us via Contact – LORIOT INDUSTRIAL.
