September 8, 2026 Kester R560 Solder Paste for Low-Voiding BGA Assembly
Kester R560 Solder Paste is a high-performance organic acid, water-soluble solder paste specifically engineered to drastically reduce voiding in Ball Grid Array (BGA) connections. Formulated by Kester, this specialized paste lowers BGA voiding rates from typical 25% levels to under 5% while providing exceptional environmental stability during Surface Mount Technology (SMT) production.
Key Performance Characteristics of Kester R560 Solder Paste
Engineered for high-reliability electronics where thermal and electrical connection integrity is paramount, this water-soluble material provides major assembly advantages:
- Dramatically decreases BGA solder joint voiding from 25% to less than 5%.
- High resistance to environmental extremes in temperature and relative humidity.
- Superior anti-slump properties under high humidity conditions to prevent solder bridging.
- Aggressive activator system delivering exceptional wetting on OSP-coated boards and Ag/Pd leaded components.
- Extended stencil life and tack retention time for uninterrupted high-volume assembly runs.
Technical Specifications and Application Performance
Controlling solder joint voiding and maintaining slump resistance in variable factory atmospheres is essential for high-yield manufacturing. Implementing Kester R560 Solder Paste guarantees robust joint formation and easy post-reflow residue removal using water wash systems.
| Technical Parameter | Specification Details |
|---|---|
| Flux Chemistry | Organic Acid (Water-Soluble) |
| BGA Void Reduction | Reduces voiding from 25% to < 5% |
| Environmental Tolerance | High resistance to extreme temperature and relative humidity |
| Slump Resistance | High slump resistance in humid environments |
| Substrate Compatibility | OSP-coated boards, Ag/Pd leads, and varied metallic surfaces |
| Cleaning Requirement | Complete aqueous cleaning required post-reflow |
Conclusion
Minimizing BGA voids and ensuring high solder joint reliability under humid production conditions is seamless with Kester R560 Solder Paste. For technical support, product datasheets, or commercial supply, please connect with us via Contact – LORIOT INDUSTRIAL.
