Kester NXG1 Solder Paste for Lead-Free Assembly
Kester NXG1 Solder Paste is a premium lead-free, no-clean formulation designed to operate reliably in both air and nitrogen reflow atmospheres. Manufactured by Kester, this specialized flux system handles demanding thermal profiles while producing smooth, shiny solder joint appearances that closely resemble traditional SnPb alloys.
Key Benefits of Kester NXG1 Solder Paste
Engineered to optimize shop-floor productivity, this lead-free material delivers exceptional print stability and cosmetic joint quality:
- Handles stencil printing pause times up to 120 minutes with an effective first print down to 0.4mm (16 mil) pitch QFPs.
- Yields reflowed solder joints with a bright, shiny appearance and light-colored, non-corrosive flux residues.
- Features an industry-leading shelf life of 8 months, providing superior storage stability.
- Operates flexibly across both air and nitrogen reflow atmospheres.
- Fully compliant with ANSI/J-STD-005 standards for solder paste requirements.
Technical Specifications and Classification
Achieving stable fine-pitch printing without frequent stencil wiping minimizes downtime in high-volume Surface Mount Technology lines. Utilizing Kester NXG1 Solder Paste guarantees consistent deposition and reliable electrical insulation across diverse PCB designs.
| Technical Parameter | Specification Details |
|---|---|
| Flux Classification | ROL1 (IPC J-STD-004B) |
| Standard Compliance | ANSI/J-STD-005 Compliant |
| Alloy Type | Lead-Free (SnPb-like aesthetics) |
| Cleaning Requirement | No-Clean (Light-colored residue) |
| Reflow Atmosphere | Air or Nitrogen (N2) |
| Stencil Abandon Time | Up to 120 minutes |
| Fine Pitch Capability | Down to 0.4mm (16 mil) QFP pitch |
| Shelf Life | 8 Months |
Conclusion
Ensuring brilliant joint cosmetics and long open-times on SMT assembly lines is straightforward with Kester NXG1 Solder Paste. For technical consultation, datasheets, or commercial procurement, please reach out via Contact – LORIOT INDUSTRIAL.

