September 7, 2026 Kester NP560 Solder Paste Technical Overview
The Kester NP560 Solder Paste is a premium no-clean, lead-free, and halogen-free formula engineered to deliver high consistency and repeatability in surface-mount electronics assembly. Developed by Kester, this paste redefines performance standards for high-density printed circuit board manufacturing.
High-Precision Printing and 01005 Component Assembly
Designed for miniaturized board designs, Kester NP560 Solder Paste consistently maintains paste transfer efficiencies between 0.50 and 0.55 Area Ratio (AR). It provides robust printing and reflow capabilities for ultra-small 01005 components in air reflow environments while keeping graping behavior to an absolute minimum.
Industry-Leading Low Voiding Performance
Along with stable operational characteristics, NP560 Solder Paste sets a new benchmark for void reduction in SMT assembly. Its advanced flux chemistry exhibits potential for exceptionally low voiding performance across complex component packages and critical solder joints.
Technical Specifications
| Property | Specification Details |
|---|---|
| Product Type | No-Clean Solder Paste |
| Metallurgy & Environmental | Lead-Free (Pb-Free), Halogen-Free |
| Transfer Efficiency | 0.50 to 0.55 Area Ratio (AR) |
| Component Capability | 01005 Components in Air Reflow (Low Graping) |
| Key Advantage | Redefined Low-Voiding Standard for PCB Assembly |
Conclusion
For high-yield SMT lines requiring zero halogen compliance and superior low-voiding results on fine-pitch components, Kester NP560 Solder Paste provides exceptional reliability. For procurement, technical datasheets, and inquiries, please Contact – LORIOT INDUSTRIAL.
