September 8, 2026 WP616 Solder Paste for Water-Soluble Lead-Free Assembly
WP616 Solder Paste is a zero-halogen, lead-free, water-soluble solder paste formula designed for both nitrogen and air reflow applications. Manufactured by Kester, this stable material delivers consistent printing performance across broad humidity levels while combining superior solderability with effortless post-reflow cleaning.
Key Benefits of WP616 Solder Paste
Engineered for high-yield Surface Mount Technology (SMT) lines requiring strict zero-halogen compliance, this water-soluble formulation provides distinct operational advantages:
- Zero-halogen flux chemistry classified as ORM0 under IPC J-STD-004B standards.
- Versatile performance across both air and nitrogen (N2) reflow atmospheres.
- Consistent print definition and aperture release over wide relative humidity ranges.
- Stable water-soluble formula maintaining long stencil life and reliable tack time.
- Excellent solderability and easy residue removal with standard warm water wash systems.
Technical Specifications and Process Capability
Maintaining stable paste rheology and deposit geometry across varying shop-floor conditions reduces defect rates. Utilizing WP616 Solder Paste ensures excellent joint formation and complete environmental compliance for critical electronic assemblies.
| Technical Parameter | Specification Details |
|---|---|
| Flux Classification | ORM0 (IPC J-STD-004B) |
| Halogen Content | Zero-Halogen |
| Alloy Compatibility | Lead-Free |
| Reflow Atmosphere | Air or Nitrogen (N2) |
| Humidity Tolerance | Stable print performance across wide humidity ranges |
| Cleaning Requirement | Aqueous wash mandatory post-reflow |
Conclusion
Streamlining zero-halogen lead-free processing with easy water cleaning is efficient with WP616 Solder Paste. For technical datasheets, procurement, or direct engineering support, please reach out via Contact – LORIOT INDUSTRIAL.
