September 3, 2026 ALPHA OM-565 HRL3 Solder Paste
ALPHA OM-565 HRL3 is a zero-halogen, low-temperature solder paste engineered specifically for the HRL3 alloy to enable a target peak reflow profile of 175°C. Formulated by industry leader MacDermid Alpha, this chemistry mitigates warpage-induced defects in temperature-sensitive chip-scale packages.
Performance Characteristics of OM-565 HRL3
Featuring superior wettability during low-thermal-stress processing, the paste significantly reduces post-reflow soldering anomalies while providing enhanced electrochemical reliability across dense board designs.
- Zero-halogen, low-temperature flux formulation paired with HRL3 alloy.
- Enables low peak reflow processing temperatures down to 175°C.
- Mitigates component warpage and limits Non-Wet-Open (NWO) and Head-In-Pillow (HiP) defects.
- Enhanced electrochemical performance compared to traditional low-melt point solders.
Assembly Integration and Compatibility
Utilizing ALPHA OM-565 HRL3 across temperature-sensitive SMT lines ensures robust joint integrity and provides excellent compatibility when combined with alternative ALPHA solutions for contact rework operations.
Product Specifications
| Property | Specification Details |
|---|---|
| Product Name | ALPHA OM-565 HRL3 |
| Alloy System | HRL3 Alloy |
| Flux Classification | Zero-Halogen, Low-Temperature |
| Target Peak Reflow Temperature | 175°C |
| Primary Advantages | Warpage Mitigation, NWO & HiP Reduction |
Conclusion
Deploying ALPHA OM-565 HRL3 protects delicate electronic packages from thermal distortion while maintaining high interconnect yield. For technical datasheets or product availability, please visit Contact – LORIOT INDUSTRIAL.
