September 4, 2026 ALPHA WS-945CPS Solder Paste for SiP Assembly
ALPHA WS-945CPS Solder Paste is a high-performance, lead-free, water-soluble material engineered specifically for System-in-Package (SiP) applications containing high-density small components. Developed by MacDermid Alpha, this advanced formulation enables precise 50µm feature printing while providing exceptional reflow performance and minimal voiding.
Key Advantages of ALPHA WS-945CPS Solder Paste
To meet the rigorous demands of modern electronics manufacturing, this material delivers critical technical benefits for ultra-fine-pitch assembly:
- Fine-Feature Printing: Fully supports fine-pitch printing down to 50µm to accommodate compact packaging requirements.
- Powder Compatibility: Optimized for ultra-fine powder sizes, including Type 6 and Type 7 alloys.
- Lead-Free Flexibility: Compatible with a broad range of lead-free solder alloy compositions.
- Void Reduction & Cleanability: Delivers minimal voiding post-reflow alongside excellent water-wash residue removal.
Technical Specifications Summary
The table below highlights the core performance criteria and material characteristics:
| Technical Property | Specification / Capability |
|---|---|
| Chemistry Type | Water-Soluble, Lead-Free |
| Target Application | System-in-Package (SiP) & Fine-Feature Assembly |
| Minimum Print Capability | 50 µm |
| Compatible Powder Types | Type 6 and Type 7 |
| Cleaning Requirement | Aqueous / Water Cleanable |
Conclusion
Deploying ALPHA WS-945CPS Solder Paste guarantees outstanding printing accuracy and low-voiding solder connections for intricate packaging designs. For datasheet requests, purchasing details, or technical assistance, please reach out via Contact – LORIOT INDUSTRIAL.
