September 4, 2026 Kester EM828 Solder Paste Technical Overview
The Kester EM828 Solder Paste is a breakthrough lead-free, water-soluble solution engineered specifically to reduce voiding behavior in modern electronic assembly. Developed by Kester, this formula combines minimal voiding with superior wetting and effortless post-reflow cleaning.
Printing Stability and Operational Efficiency
Designed for demanding surface-mount production lines, Kester EM828 Solder Paste exhibits outstanding stability during stencil printing. It maintains reliable volume deposition and print performance regardless of print speed, line throughput, or extended idle times.
Wetting Performance and Compatibility
With its advanced formulation, EM828 Solder Paste provides tremendous wetting across a broad array of circuit board and component lead finishes, streamlining the transition to lead-free manufacturing. Note: Due to REACH Regulation changes, this product is no longer supplied into Europe or to European customers.
Technical Specifications
| Property | Specification Details |
|---|---|
| Product Type | Water-Soluble Solder Paste |
| Alloy Composition | Lead-Free (Pb-Free) |
| Primary Advantage | Low Voiding, Easy Water Cleaning |
| Process Capability | Stable Stencil Printing Across Varied Speeds and Idle Times |
| Regulatory Status | Not available for sale into Europe/European customers (REACH Compliance) |
Conclusion
For high-reliability lead-free manufacturing requiring low voiding performance, Kester EM828 Solder Paste delivers excellent wetting and process consistency. To receive technical advice or purchase details, please Contact – LORIOT INDUSTRIAL.
