September 4, 2026 Kester EP256HA Solder Paste High-Activity Solution
The Kester EP256HA Solder Paste is a premium no-clean, air or nitrogen reflowable formula designed for maximum print performance and solderability. Manufactured by Kester, this formulation is engineered to join lead-free components using leaded solder paste under demanding assembly conditions.
Ultimate Activity and Surface Metallization Handling
Specifically developed for challenging electronic assemblies, EP256HA Solder Paste provides ultimate flux activity when soldering to difficult-to-wet components and board surface metallizations. Classified as ROL0, it offers exceptional post-reflow reliability without requiring aggressive residue removal.
Printing Robustness and Rheological Stability
On the production floor, Kester EP256HA Solder Paste supports stencil printing downtimes of up to 90 minutes while maintaining an effective first print down to 20 mils. The paste retains its full activity and printing rheology for up to 8 hours without experiencing shear thinning.
Technical Specifications
| Property | Specification Details |
|---|---|
| Product Type | No-Clean Solder Paste |
| ROSN Flux Classification | ROL0 |
| Reflow Atmosphere | Air or Nitrogen (N2) |
| Application Scope | Leaded Solder Paste for Lead-Free Components and Difficult Metallizations |
| Printing Capabilities | 90-Minute Stencil Downtime, 8-Hour Print Life Without Shear Thinning |
Conclusion
For complex electronic assembly requiring high activity and excellent downtime stability, Kester EP256HA Solder Paste ensures consistent manufacturing quality. For technical support, datasheets, and ordering, please Contact – LORIOT INDUSTRIAL.
