September 3, 2026 ALPHA WS-699CPS Solder Paste
ALPHA WS-699CPS is a high-performance water-soluble fine-pitch solder paste engineered for high-density surface mount and solder bumping applications. Developed by industry leader MacDermid Alpha, this RoHS-compatible formulation delivers outstanding printing, reflow, and post-assembly residue cleanability.
Fine Pitch Printing and Reflow Features of ALPHA WS-699CPS
Formulated with a SAC305 (Sn96.5/Ag3/Cu0.5) lead-free alloy comprising 89% metal content, the paste exhibits a melting range between 217°C and 220°C with exceptional process control for fine powders such as Type 6 and Type 7.
- Capable of 50 µm stencil aperture printing performance for ultra-fine pitch features.
- Water-soluble flux system offering easy post-reflow residue removal.
- Broad processing window suitable for SMT assembly and wafer bumping.
- Demonstrates ultra-low voiding performance across high-density pads.
Applications and Packaging Options
Integrating WS-699CPS into precision electronics assembly lines ensures reproducible deposit volumes and high assembly yields. To suit diverse automated dispensing and printing equipment, it is available in standard jar and cartridge packaging formats.
Product Specifications
| Property | Specification Details |
|---|---|
| Product Name | ALPHA WS-699CPS |
| Alloy Composition | Sn96.5 / Ag3.0 / Cu0.5 (SAC305) |
| Melting Temperature Range | 217°C to 220°C |
| Aperture Printing Limit | 50 µm |
| Powder Compatibility | Fine powder sizes (Type 6 and Type 7) |
Conclusion
Deploying ALPHA WS-699CPS delivers top-tier printing precision and reliable interconnects for advanced miniaturized electronics. To order commercial quantities or request technical documentation, please visit Contact – LORIOT INDUSTRIAL.
