September 3, 2026 ALPHA WS-698 Flux
ALPHA WS-698 is a water-soluble, high-activity paste flux engineered for soldering a variety of lead-free and tin-lead eutectic alloys onto area array packages. Developed by industry leader MacDermid Alpha, this advanced flux chemistry provides superior wetting performance on tough pad finishes while delivering ultra-low voiding results.
Technical Features and Surface Compatibility of ALPHA WS-698
Formulated to meet modern high-reliability packaging demands, the halogen-free material exhibits high fluxing activity, significantly reducing missing ball rates and improving overall assembly yields across complex board layouts.
- High fluxing activity engineered for lead-free and tin-lead eutectic alloys.
- Water-soluble residue formulation allowing easy post-reflow cleaning.
- Superior compatibility with Cu-OSP, electrolytic Ni-Au, and ENIG surface finishes.
- Halogen-free compliant formulation providing excellent spread and low voiding.
Applications in Area Array Packaging
Utilizing ALPHA WS-698 across area array packaging operations guarantees consistent solder joint formation. Its exceptional wetting characteristics ensure maximum yield efficiency and reliable interconnects on difficult-to-solder metallic substrates.
Product Specifications
| Property | Specification Details |
|---|---|
| Product Name | ALPHA WS-698 |
| Flux Type | Water-Soluble High-Activity Paste Flux |
| Compliance & Safety | Halogen-Free Compliant |
| Compatible Alloys | Lead-Free & Tin-Lead Eutectic Alloys |
| Compatible Finishes | Cu-OSP, Electrolytic Ni-Au, ENIG |
Conclusion
Deploying ALPHA WS-698 ensures exceptional wetting, low voiding, and high manufacturing yields for demanding semiconductor packaging applications. To inquire about ordering details or technical support, please visit Contact – LORIOT INDUSTRIAL.
