September 3, 2026 ALPHA OM-5100 Solder Paste
ALPHA OM-5100 is a low-residue, no-clean solder paste engineered to maximize first pass yields in automated SMT manufacturing. Formulated by industry leader MacDermid Alpha, this paste features a rheologically optimized flux vehicle designed to streamline paste deposition and minimize post-reflow soldering defects.
Performance Features and Solderability of OM-5100
The specialized activation system enhances overall joint solderability across complex board layouts, supporting broad processing profiles compatible with lead-free component metallurgy.
- Rheologically formulated flux vehicle engineered to maximize first pass yields.
- Low-residue, no-clean chemistry reducing post-reflow cleaning requirements.
- Broad reflow profile window designed for seamless lead-free soldering.
- Full coalescence on small print deposits, even under hot profiles required for SAC305 BGA spheres.
Assembly Integration for Fine Passives and BGAs
Integrating ALPHA OM-5100 into production lines ensures exceptional solderability on complex assemblies, ranging from tiny 0201 tin-finished passive components to large 1 mm pitch Ball Grid Arrays (BGAs) with lead-free spheres.
Product Specifications
| Property | Specification Details |
|---|---|
| Product Name | ALPHA OM-5100 |
| Flux Classification | Low-Residue, No-Clean |
| Component Compatibility | 0201 passives, 1 mm pitch BGAs with SAC305 spheres |
| Process Window | Wide Reflow Profile Window (Lead-Free Compatible) |
| Primary Benefit | Maximizes First Pass Yields & Minimizes Defects |
Conclusion
Selecting ALPHA OM-5100 delivers consistent deposit coalescence and high manufacturing yields for high-density electronic assemblies. To place orders or receive technical support, please visit Contact – LORIOT INDUSTRIAL.
