September 3, 2026 ALPHA OM-362 Solder Paste
ALPHA OM-362 is an ultra-low voiding, high-reliability, zero-halogen, and RoHS-compliant solder paste engineered for demanding SMT manufacturing. Produced by industry leader MacDermid Alpha, this lead-free, no-clean formulation in T4 powder is specifically designed to eliminate voiding defects across all component types.
Ultra-Low Voiding Features of ALPHA OM-362
Formulated for exceptional thermal and mechanical joint integrity, the paste delivers consistent printing and reflow performance when paired with high-reliability alloys like Innolot® and traditional SAC alloys.
- Lead-free, zero-halogen, and no-clean T4 powder solder paste system.
- Achieves IPC Class III voiding performance on Ball Grid Array (BGA) components.
- Yields less than 10% average voiding on Bottom Terminated Components (BTC).
- RoHS compliant formulation designed for high-reliability alloy compatibility.
Applications and Component Integration
Deploying OM-362 in advanced surface-mount assemblies minimizes void formation under bottom-terminated packages, ensuring maximum thermal dissipation and structural reliability in critical electronic circuits.
Product Specifications
| Property | Specification Details |
|---|---|
| Product Name | ALPHA OM-362 |
| Powder Size | Type 4 (T4) |
| Compliance & Classification | RoHS Compliant, Zero-Halogen, No-Clean |
| BGA Voiding Standard | IPC Class III |
| BTC Voiding Rate | Less than 10% average |
Conclusion
Selecting ALPHA OM-362 provides electronic assembly lines with market-leading voiding control and robust interconnect durability. To request product availability or technical datasheets, please visit Contact – LORIOT INDUSTRIAL.
