September 3, 2026 ALPHA OM-5300 Solder Paste
ALPHA OM-5300 is a zero-halogen, no-clean solder paste specifically developed to meet the demands of tin-lead soldering when lead-free components are present in the circuit assembly. Formulated by industry leader MacDermid Alpha, this advanced paste provides exceptional performance during complex mixed-metallurgy assembly processes.
Printing and Reflow Performance of ALPHA OM-5300
The paste delivers excellent print volume repeatability and minimizes cycle times by enabling high squeegee speeds while extending the required intervals between stencil under-wipes.
- Zero-halogen, no-clean formulation designed for mixed-technology soldering.
- High print speed capability with extended intervals between stencil undercleans.
- Engineered to withstand long, hot soak reflow profiles for optimal wetting.
- Delivers excellent Ball Grid Array (BGA) voiding control and high post-reflow SIR performance.
Assembly Integration for Mixed Metallurgy
Integrating OM-5300 into SMT production lines allows tin-lead solder paste alloys to thoroughly wet lead-free component surfaces. This ensures reliable joint formation, low voiding rates, and superior insulation resistance across high-density circuit boards.
Product Specifications
| Property | Specification Details |
|---|---|
| Product Name | ALPHA OM-5300 |
| Flux Classification | Zero-Halogen, No-Clean |
| Target Application | Tin-lead soldering with lead-free components |
| Key Features | Long hot soak resistance, excellent BGA voiding, high SIR |
| Printing Efficiency | High-speed printing with reduced stencil wipe frequency |
Conclusion
Deploying ALPHA OM-5300 ensures maximum soldering reliability and printing efficiency when combining traditional tin-lead pastes with modern lead-free components. To place commercial orders or request technical support, please visit Contact – LORIOT INDUSTRIAL.
